Wan-Kuo Chih

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing solder mask of printed circuit board
- Patent number 7,080,447
- Issue date Jul 25, 2006
- Ultratera Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having permanent solder mask
- Patent number 6,933,448
- Issue date Aug 23, 2005
- S & S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having permanent solder mask
- Patent number 6,753,480
- Issue date Jun 22, 2004
- Ultratera Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing solder mask of printed circuit board
- Patent number 6,395,625
- Issue date May 28, 2002
- S & S Technology Corporation
- Chong-Ren Maa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing solder mask of printed circuit board
- Publication number 20040172818
- Publication date Sep 9, 2004
- S&S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board having permanent solder mask
- Publication number 20040149681
- Publication date Aug 5, 2004
- S&S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure of printed circuit board (PCB)
- Publication number 20040007386
- Publication date Jan 15, 2004
- S & S Technology Corporation
- Ching-Hua Tsou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming connections on a conductor pattern of a printed c...
- Publication number 20030204949
- Publication date Nov 6, 2003
- ULTRATERA CORPORATION
- Wan-Kuo Chih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire-bonded chip on board package
- Publication number 20030205793
- Publication date Nov 6, 2003
- Chong-Ren Maa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip package
- Publication number 20030201544
- Publication date Oct 30, 2003
- Chong-Ren Maa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board having permanent solder mask
- Publication number 20030070835
- Publication date Apr 17, 2003
- S&S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing solder mask of printed circuit board
- Publication number 20030072927
- Publication date Apr 17, 2003
- S&S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing solder mask of printed circuit board
- Publication number 20030071014
- Publication date Apr 17, 2003
- S&S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Wan-Kuo Chih

Person

Patents Grantslast 30 patents

Method of manufacturing solder mask of printed circuit board

Printed circuit board having permanent solder mask

Printed circuit board having permanent solder mask

Method for manufacturing solder mask of printed circuit board

Patents Applicationslast 30 patents

Method of manufacturing solder mask of printed circuit board

Printed circuit board having permanent solder mask

Structure of printed circuit board (PCB)

Method of forming connections on a conductor pattern of a printed c...

Wire-bonded chip on board package

Flip chip package

Printed circuit board having permanent solder mask

Method for manufacturing solder mask of printed circuit board

Method for manufacturing solder mask of printed circuit board