Wan Lay Looi

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Johor, MY

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit system with metal-insulator-metal circuit element
- Patent number 8,134,196
- Issue date Mar 13, 2012
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with bump pad
- Patent number 8,008,770
- Issue date Aug 30, 2011
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS