Wan Lay Looi

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit system for bonding
- Patent number 7,381,634
- Issue date Jun 3, 2008
- Stats Chippac Ltd.
- Yaojian Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP PAD
- Publication number 20070114639
- Publication date May 24, 2007
- STATS ChipPAC Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH METAL-INSULATOR-METAL CIRCUIT ELEMENT
- Publication number 20070108615
- Publication date May 17, 2007
- STATS ChipPAC Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM FOR BONDING
- Publication number 20060231948
- Publication date Oct 19, 2006
- STATS ChipPAC Ltd.
- Yaojian Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM FOR DIFFERENT BOND PADS IN AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20060197223
- Publication date Sep 7, 2006
- ST ASSEMBLY TEST SERVICES LTD.
- Lun Zhao
- H01 - BASIC ELECTRIC ELEMENTS