Wan Lay Looi

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Jahore, MY

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Patents Grantslast 30 patents

Information Patent Grant
System for different bond pads in an integrated circuit package
- Patent number 7,443,039
- Issue date Oct 28, 2008
- ST Assembly Test Services Ltd.
- Lun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing different bond pads on the same substrate o...
- Patent number 7,005,370
- Issue date Feb 28, 2006
- ST Assembly Test Services Ltd.
- Lun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING DIFFERENT BOND PADS ON THE SAME SUBSTRATE O...
- Publication number 20050253262
- Publication date Nov 17, 2005
- ST ASSEMBLY TEST SERVICES LTD.
- Lun Zhao
- H01 - BASIC ELECTRIC ELEMENTS