Wan-ping Hsieh

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
FinFET with bowl-shaped gate isolation and method
- Patent number 12,166,035
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,051,700
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Fong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, FinFET device and methods of forming the same
- Patent number 11,984,485
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Masking layer with post treatment
- Patent number 11,728,173
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench filling through reflowing filling material
- Patent number 11,605,555
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,532,628
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Fong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition tool and method
- Patent number 11,530,479
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ting Ko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device, FinFET device and methods of forming the same
- Patent number 11,271,083
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe and semiconductor package having downset baffle paddles
- Patent number 7,812,430
- Issue date Oct 12, 2010
- Powertech Technology Inc.
- Chin-Fa Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selenophene compounds
- Patent number 7,803,799
- Issue date Sep 28, 2010
- National Health Research Institutes
- Kak-Shan Shia
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Leadframe-based semiconductor package having arched bend in a suppo...
- Patent number 7,619,307
- Issue date Nov 17, 2009
- Powertech Technology Inc.
- Chin-Fa Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with fastened leads
- Patent number 7,564,123
- Issue date Jul 21, 2009
- Powertech Technology Inc.
- Chin-Fa Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH BONDING LAYERS
- Publication number 20250015131
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan Chen HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-GATE DEVICE WITH AN INSULATING LAYER BETWEEN TOP AND...
- Publication number 20240413220
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240413157
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Fong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL
- Publication number 20240379407
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FINFET DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20240258390
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH GATE ISOLATION STRUCTURE
- Publication number 20240145249
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Gang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Regions For Isolating Transistors and the Methods Forming...
- Publication number 20240120236
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Jung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Masking Layer with Post Treatment
- Publication number 20230335406
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench Filling Through Reflowing Filling Material
- Publication number 20230215758
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20230116949
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Fong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE TRANSISTORS AND METHODS OF FORMING THE SAME
- Publication number 20230054243
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE TRANSISTORS HAVING DEEP INNER SPACERS
- Publication number 20230058459
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET WITH BOWL-SHAPED GATE ISOLATION AND METHOD
- Publication number 20230011218
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Chen HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure And Method For Forming The Same
- Publication number 20220415888
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION TOOL AND METHOD
- Publication number 20220356573
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Device and Method
- Publication number 20220278098
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Fong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FINFET DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20220238669
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Masking Layer With Post Treatment
- Publication number 20220102152
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench Filling Through Reflowing Filling Material
- Publication number 20210327749
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION TOOL AND METHOD
- Publication number 20210115557
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ting Ko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, FINFET DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20210098584
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-BASED SEMICONDUCTOR PACKAGE HAVING ARCHED BEND IN A SUPPO...
- Publication number 20090302443
- Publication date Dec 10, 2009
- Powertech Technology Inc.
- Chin-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COL SEMICONDUCTOR PACKAGE
- Publication number 20090236710
- Publication date Sep 24, 2009
- Powertech Technology Inc.
- Wan-Jung HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND SEMICONDUCTOR PACKAGE HAVING DOWNSET BAFFLE PADDLES
- Publication number 20090224380
- Publication date Sep 10, 2009
- Powertech Technology Inc.
- Chin-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PYRAZOLE COMPOUNDS
- Publication number 20090042864
- Publication date Feb 12, 2009
- National Health Research Institutes
- Kak-Shan Shia
- C07 - ORGANIC CHEMISTRY
Information Patent Application
PYRAZOLE COMPOUNDS
- Publication number 20080090809
- Publication date Apr 17, 2008
- National Health Research Institutes
- Kak-Shan Shia
- C07 - ORGANIC CHEMISTRY
Information Patent Application
SELENOPHENE COMPOUNDS
- Publication number 20080021031
- Publication date Jan 24, 2008
- National Health Research Institute
- Kak-Shan Shia
- C07 - ORGANIC CHEMISTRY

Wan-ping Hsieh

Person

Patents Grantslast 30 patents

FinFET with bowl-shaped gate isolation and method

Semiconductor device and method

Semiconductor device, FinFET device and methods of forming the same

Masking layer with post treatment

Trench filling through reflowing filling material

Semiconductor device and method

Atomic layer deposition tool and method

Semiconductor device, FinFET device and methods of forming the same

Leadframe and semiconductor package having downset baffle paddles

Selenophene compounds

Leadframe-based semiconductor package having arched bend in a suppo...

Semiconductor package with fastened leads

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH BONDING LAYERS

STACKED MULTI-GATE DEVICE WITH AN INSULATING LAYER BETWEEN TOP AND...

SEMICONDUCTOR DEVICE AND METHOD

TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL

SEMICONDUCTOR DEVICE, FINFET DEVICE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH GATE ISOLATION STRUCTURE

Isolation Regions For Isolating Transistors and the Methods Forming...

Masking Layer with Post Treatment

Trench Filling Through Reflowing Filling Material

Semiconductor Device and Method

MULTI-GATE TRANSISTORS AND METHODS OF FORMING THE SAME

MULTI-GATE TRANSISTORS HAVING DEEP INNER SPACERS

FINFET WITH BOWL-SHAPED GATE ISOLATION AND METHOD

Semiconductor Structure And Method For Forming The Same

ATOMIC LAYER DEPOSITION TOOL AND METHOD

Semiconductor Device and Method

SEMICONDUCTOR DEVICE, FINFET DEVICE AND METHODS OF FORMING THE SAME

Masking Layer With Post Treatment

Trench Filling Through Reflowing Filling Material

ATOMIC LAYER DEPOSITION TOOL AND METHOD

SEMICONDUCTOR DEVICE, FINFET DEVICE AND METHODS OF FORMING THE SAME

LEADFRAME-BASED SEMICONDUCTOR PACKAGE HAVING ARCHED BEND IN A SUPPO...

COL SEMICONDUCTOR PACKAGE

LEADFRAME AND SEMICONDUCTOR PACKAGE HAVING DOWNSET BAFFLE PADDLES

PYRAZOLE COMPOUNDS

PYRAZOLE COMPOUNDS

SELENOPHENE COMPOUNDS