Wan-Ting CHIU

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for manufacturing a package structure
- Patent number 12,183,593
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,798,859
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 9,768,139
- Issue date Sep 19, 2017
- Advanced Semiconductor Engineering, Inc.
- Wan-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 9,508,671
- Issue date Nov 29, 2016
- Advanced Semiconductor Engineering, Inc.
- Wan-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR MANUFACTURING A PACKAGE STRUCTURE
- Publication number 20220384208
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220367306
- Publication date Nov 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20170040279
- Publication date Feb 9, 2017
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Wan-Ting CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20160307864
- Publication date Oct 20, 2016
- Advanced Semiconductor Engineering, Inc.
- Wan-Ting CHIU
- H01 - BASIC ELECTRIC ELEMENTS