Wanchun DING

Follow

Person

Nantong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Fabricating method for wafer-level packaging
- Patent number 10,008,478
- Issue date Jun 26, 2018
- TONGFU MICROELECTRONICS CO., LTD.
- Wanchun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and forming method therefor
- Patent number 9,515,010
- Issue date Dec 6, 2016
- NANTONG FUJITSU MICROELECTRONICS., LTD.
- Xin Xia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATING METHOD FOR WAFER-LEVEL PACKAGING
- Publication number 20170213810
- Publication date Jul 27, 2017
- Wanchun DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure And Forming Method Therefor
- Publication number 20160043020
- Publication date Feb 11, 2016
- Xin XIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20150380369
- Publication date Dec 31, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Wanchun DING
- H01 - BASIC ELECTRIC ELEMENTS