Wang Chuen Khiang

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Multiple die stack package
- Patent number 8,288,862
- Issue date Oct 16, 2012
- United Test & Assembly Center Limited
- Wang Chuen Khiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a microchip device
- Patent number 7,504,715
- Issue date Mar 17, 2009
- United Test & Assembly Center Limited
- Wang Chuen Khiang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Packaging of a microchip device
- Patent number 7,443,041
- Issue date Oct 28, 2008
- United Test & Assembly Center Limited
- Wang Chuen Khiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a microchip device
- Patent number 7,129,115
- Issue date Oct 31, 2006
- United Test & Assembly Center Limited
- Wang Chuen Khiang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multiple chip semiconductor packages
- Patent number 7,023,076
- Issue date Apr 4, 2006
- United Test & Assembly Center Limited
- Wang Chuen Khiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING OF A MICROCHIP DEVICE
- Publication number 20070013040
- Publication date Jan 18, 2007
- United Test & Assembly Center Limited
- Wang Chuen Khiang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Packaging of a microchip device
- Publication number 20050257955
- Publication date Nov 24, 2005
- Wang Chuen Khiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging of a microchip device-I
- Publication number 20040121511
- Publication date Jun 24, 2004
- Wang Chuen Khiang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Multiple chip semiconductor packages
- Publication number 20040012079
- Publication date Jan 22, 2004
- United Test & Assembly Center Limited of Singapore
- Wang Chuen Khiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20030197284
- Publication date Oct 23, 2003
- United Test & Assembly Center Limited
- Wang Chuen Khiang
- H01 - BASIC ELECTRIC ELEMENTS