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Wang-Hsiang Tsai
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Taoyuan City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Manufacturing method of package structure
Patent number
11,895,780
Issue date
Feb 6, 2024
Unimicron Technology Corp.
Kai-Ming Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board structure and spliced circuit board
Patent number
11,477,886
Issue date
Oct 18, 2022
Unimicron Technology Corp.
Yunn-Tzu Yu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board and manufacturing method thereof
Patent number
11,127,664
Issue date
Sep 21, 2021
Unimicron Technology Corp.
Ra-Min Tain
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrical connector with independently biasable conducting terminals
Patent number
10,135,169
Issue date
Nov 20, 2018
ACES ELECTRONICS CO., LTD
Toshiharu Shimoju
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked package module and board having exposed ends
Patent number
7,968,991
Issue date
Jun 28, 2011
Unimicron Technology Corp.
Lin-Yin Wong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-conductor flat cable connector
Patent number
7,559,772
Issue date
Jul 14, 2009
P-Two Industries Inc.
Wang-Kun Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical connector having insulative housing and flexible bus
Patent number
7,438,590
Issue date
Oct 21, 2008
P-Two Industries Inc.
Shih-Chieh Liang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CIRCUIT BOARD STRUCTURE AND SPLICED CIRCUIT BOARD
Publication number
20220232702
Publication date
Jul 21, 2022
Unimicron Technology Corp.
Yunn-Tzu Yu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
Publication number
20210195761
Publication date
Jun 24, 2021
Unimicron Technology Corp.
Kai-Ming YANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20200068721
Publication date
Feb 27, 2020
Unimicron Technology Corp.
Kai-Ming YANG
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20170374748
Publication date
Dec 28, 2017
Unimicron Technology Corp.
Kai-Ming YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20170110393
Publication date
Apr 20, 2017
Unimicron Technology Corp.
Ra-Min Tain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked package module
Publication number
20080246135
Publication date
Oct 9, 2008
PHOENIX PRECISION TECHNOLOGY CORPORATION
Lin-Yin Wong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRICAL CONNECTOR HAVING INSULATIVE HOUSING AND FLEXIBLE BUS
Publication number
20080242155
Publication date
Oct 2, 2008
Shih-Chieh Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked package module
Publication number
20080230886
Publication date
Sep 25, 2008
PHOENIX PRECISION TECHNOLOGY CORPORATION
Lin-Yin Wong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electrical connector
Publication number
20070298659
Publication date
Dec 27, 2007
Wang-Kun Tsai
H01 - BASIC ELECTRIC ELEMENTS