Wang-Jung HSUEH

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Via rail structure
- Patent number 12,199,034
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hao Kuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Via-first process for connecting a contact and a gate electrode
- Patent number 12,125,743
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact formation method and related structure
- Patent number 11,915,971
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-first process for connecting a contact and a gate electrode
- Patent number 11,670,544
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of fabrication thereof
- Patent number 11,640,936
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact formation method and related structure
- Patent number 11,322,394
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-first process for connecting a contact and a gate electrode
- Patent number 11,189,525
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-resistance interconnect structures
- Patent number 11,127,684
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact formation method and related structure
- Patent number 10,636,697
- Issue date Apr 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE
- Publication number 20240371687
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION METHOD AND RELATED STRUCTURE
- Publication number 20240194520
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA RAIL STRUCTURE
- Publication number 20230411280
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hao Kuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF
- Publication number 20230260900
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE
- Publication number 20230253244
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONTACT...
- Publication number 20230033570
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION METHOD AND RELATED STRUCTURE
- Publication number 20220336268
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Fabrication Thereof
- Publication number 20220223517
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE
- Publication number 20220093456
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE
- Publication number 20210265202
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Resistance Interconnect Structures
- Publication number 20210118801
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via Rail Structure
- Publication number 20210098369
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hao Kuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTACT FORMATION METHOD AND RELATED STRUCTURE
- Publication number 20200161173
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION METHOD AND RELATED STRUCTURE
- Publication number 20190164813
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsun WANG
- H01 - BASIC ELECTRIC ELEMENTS

Wang-Jung HSUEH

Person

Patents Grantslast 30 patents

Via rail structure

Via-first process for connecting a contact and a gate electrode

Contact formation method and related structure

Via-first process for connecting a contact and a gate electrode

Interconnect structures and methods of fabrication thereof

Contact formation method and related structure

Via-first process for connecting a contact and a gate electrode

Low-resistance interconnect structures

Contact formation method and related structure

Patents Applicationslast 30 patents

VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE

CONTACT FORMATION METHOD AND RELATED STRUCTURE

VIA RAIL STRUCTURE

INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF

VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CONTACT...

CONTACT FORMATION METHOD AND RELATED STRUCTURE

Interconnect Structures and Methods of Fabrication Thereof

VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE

VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE

Low-Resistance Interconnect Structures

Via Rail Structure

CONTACT FORMATION METHOD AND RELATED STRUCTURE

CONTACT FORMATION METHOD AND RELATED STRUCTURE