WANG-LAI YANG

Person

Zhongshan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,950,563
- Issue date Mar 16, 2021
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,867,942
- Issue date Dec 15, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,818,619
- Issue date Oct 27, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,770,417
- Issue date Sep 8, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing lead frame
- Patent number 9,379,505
- Issue date Jun 28, 2016
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package assembly and method of manufacturing the same
- Patent number 8,981,571
- Issue date Mar 17, 2015
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor package using the same
- Patent number 8,587,100
- Issue date Nov 19, 2013
- Ambit Microsystems (Zhongshan) Ltd.
- Wang-Lai Yang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200388585
- Publication date Dec 10, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200335462
- Publication date Oct 22, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20190172805
- Publication date Jun 6, 2019
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140054792
- Publication date Feb 27, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- WANG-LAI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LEAD FRAME AND SEMICONDUCTOR PACKAGE USING...
- Publication number 20130239409
- Publication date Sep 19, 2013
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- WANG-LAI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PAC...
- Publication number 20110309484
- Publication date Dec 22, 2011
- HON HAI Precision Industry CO., LTD.
- WANG-LAI YANG
- H01 - BASIC ELECTRIC ELEMENTS

WANG-LAI YANG

Person

Patents Grantslast 30 patents

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Method of manufacturing lead frame

Package assembly and method of manufacturing the same

Lead frame and semiconductor package using the same

Patents Applicationslast 30 patents

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING LEAD FRAME AND SEMICONDUCTOR PACKAGE USING...

LEAD FRAME, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PAC...