Wang Zhang

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional module with integrated passive components
- Patent number 11,217,542
- Issue date Jan 4, 2022
- SOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Guobiao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-bit-per-cell three-dimensional resistive random-access memory...
- Patent number 11,170,863
- Issue date Nov 9, 2021
- SOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Guobiao Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and system for implementing verification within data transfer
- Patent number 10,491,607
- Issue date Nov 26, 2019
- Tencent Technology (Shenzhen) Company Limited
- Dezhi Wei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming current diffusion layer in light emitting diode...
- Patent number 9,401,457
- Issue date Jul 26, 2016
- BYD Company Limited
- Wanshi Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Epitaxial wafer for light emitting diode, light emitting diode chip...
- Patent number 9,093,596
- Issue date Jul 28, 2015
- BYD Company Limited
- Dongming Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED structure, LED device and methods for forming the same
- Patent number 8,975,652
- Issue date Mar 10, 2015
- Shenzhen BYD Auto R&D Company Limited
- Jihang Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxiay wafer, method for manufacturing the same and method for m...
- Patent number 8,932,892
- Issue date Jan 13, 2015
- Shenzhen BYD Auto R&D Company Limited
- Wang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, method of forming the substrate structure and...
- Patent number 8,928,006
- Issue date Jan 6, 2015
- Shenzhen BYD Auto R&D Company Limited
- Chunlin Xie
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Epitaxial wafer and manufacturing method thereof
- Patent number 8,859,315
- Issue date Oct 14, 2014
- BYD Company Limited
- Xilin Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and method for preparing the same
- Patent number 8,723,188
- Issue date May 13, 2014
- Shenzhen BYD Auto R&D Company Limited
- Chunlin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for upsampling a spatial layered coded video image
- Patent number 8,718,130
- Issue date May 6, 2014
- Huawei Technologies Co., Ltd.
- Lianhuan Xiong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Epitaxial wafer and manufacturing method thereof
- Patent number 8,324,634
- Issue date Dec 4, 2012
- BYD Company Limited
- Xilin Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BLOCKCHAIN-BASED DATA PROCESSING METHOD AND APPARATUS, COMPUTER DEV...
- Publication number 20230006842
- Publication date Jan 5, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Zhang WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Three-Dimensional Module with Integrated Passive Components
- Publication number 20210013162
- Publication date Jan 14, 2021
- SOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Guobiao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Bit-Per-Cell Three-Dimensional Resistive Random-Access Memory...
- Publication number 20200350030
- Publication date Nov 5, 2020
- SOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Guobiao ZHANG
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD AND SYSTEM FOR IMPLEMENTING VERIFICATION WITHIN DATA TRANSFER
- Publication number 20180020009
- Publication date Jan 18, 2018
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dezhi WEI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR FORMING CURRENT DIFFUSION LAYER IN LIGHT EMITTING DIODE...
- Publication number 20140091355
- Publication date Apr 3, 2014
- BYD COMPANY LIMITED
- Wanshi Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate Structure, Method of Forming the Substrate Structure and...
- Publication number 20130320355
- Publication date Dec 5, 2013
- Chunlin Xie
- C30 - CRYSTAL GROWTH
Information Patent Application
LED STRUCTURE, LED DEVICE AND METHODS FOR FORMING THE SAME
- Publication number 20130299861
- Publication date Nov 14, 2013
- BYD COMPANY LIMITED
- Jihang Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epitaxial Wafer and Manufacturing Method Thereof
- Publication number 20130052807
- Publication date Feb 28, 2013
- BYD COMPANY LIMITED
- Xilin Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAY WAFER, METHOD FOR MANUFACTURING THE SAME AND METHOD FOR M...
- Publication number 20120267607
- Publication date Oct 25, 2012
- Wang ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER FOR LIGHT EMITTING DIODE, LIGHT EMITTING DIODE CHIP...
- Publication number 20120267641
- Publication date Oct 25, 2012
- Dongming HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED, LED CHIP AND METHOD OF FORMING THE SAME
- Publication number 20120261702
- Publication date Oct 18, 2012
- Xilin SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE AND METHOD FOR PREPARING THE SAME
- Publication number 20120261708
- Publication date Oct 18, 2012
- Chunlin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER AND MANUFACTURING METHOD THEREOF
- Publication number 20100276812
- Publication date Nov 4, 2010
- BYD COMPANY LIMITED
- Xilin Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR UPSAMPLING A SPATIAL LAYERED CODED VIDEO IMAGE
- Publication number 20080205513
- Publication date Aug 28, 2008
- Huawei Technologies Co., Ltd
- Lianhuan Xiong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Person

Patents Grantslast 30 patents

Three-dimensional module with integrated passive components

Multi-bit-per-cell three-dimensional resistive random-access memory...

Method and system for implementing verification within data transfer

Method for forming current diffusion layer in light emitting diode...

Epitaxial wafer for light emitting diode, light emitting diode chip...

LED structure, LED device and methods for forming the same

Epitaxiay wafer, method for manufacturing the same and method for m...

Substrate structure, method of forming the substrate structure and...

Epitaxial wafer and manufacturing method thereof

Light emitting diode and method for preparing the same

Method and system for upsampling a spatial layered coded video image

Epitaxial wafer and manufacturing method thereof

Patents Applicationslast 30 patents

BLOCKCHAIN-BASED DATA PROCESSING METHOD AND APPARATUS, COMPUTER DEV...

Three-Dimensional Module with Integrated Passive Components

Multi-Bit-Per-Cell Three-Dimensional Resistive Random-Access Memory...

METHOD AND SYSTEM FOR IMPLEMENTING VERIFICATION WITHIN DATA TRANSFER

METHOD FOR FORMING CURRENT DIFFUSION LAYER IN LIGHT EMITTING DIODE...

Substrate Structure, Method of Forming the Substrate Structure and...

LED STRUCTURE, LED DEVICE AND METHODS FOR FORMING THE SAME

Epitaxial Wafer and Manufacturing Method Thereof

EPITAXIAY WAFER, METHOD FOR MANUFACTURING THE SAME AND METHOD FOR M...

EPITAXIAL WAFER FOR LIGHT EMITTING DIODE, LIGHT EMITTING DIODE CHIP...

LED, LED CHIP AND METHOD OF FORMING THE SAME

LIGHT EMITTING DIODE AND METHOD FOR PREPARING THE SAME

EPITAXIAL WAFER AND MANUFACTURING METHOD THEREOF

METHOD AND SYSTEM FOR UPSAMPLING A SPATIAL LAYERED CODED VIDEO IMAGE