Wanil Lee

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Incheon-Si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing equipment and method of providing suppo...
- Patent number 11,935,777
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- HyeonChul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 11,587,882
- Issue date Feb 21, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion e-bar for 3D SiP
- Patent number 11,342,294
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 10,937,741
- Issue date Mar 2, 2021
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion E-bar for 3D SIP
- Patent number 10,636,756
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Manufacturing Equipment and Method of Providing Suppo...
- Publication number 20230170242
- Publication date Jun 1, 2023
- STATS ChipPAC Pte Ltd.
- HyeonChul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20230154864
- Publication date May 18, 2023
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20210151386
- Publication date May 20, 2021
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
- Publication number 20200219835
- Publication date Jul 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20200161252
- Publication date May 21, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
- Publication number 20200013738
- Publication date Jan 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS