WANLI GUO

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Wuhan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer, bonding structure and wafer bonding method
- Patent number 11,069,647
- Issue date Jul 20, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yunpeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP BONDING METHOD
- Publication number 20240063174
- Publication date Feb 22, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TO-WAFER STACKING METHOD
- Publication number 20240047416
- Publication date Feb 8, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tanlin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE
- Publication number 20240021559
- Publication date Jan 18, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD
- Publication number 20230377938
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer, Bonding Structure And Wafer Bonding Method
- Publication number 20200335473
- Publication date Oct 22, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yunpeng ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR IMPROVING WAFER BONDING STRENGTH
- Publication number 20200176256
- Publication date Jun 4, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- YIN ZHANG
- H01 - BASIC ELECTRIC ELEMENTS