Waqas Hassan SYED

Person

Eindhoven, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Planar balun with non-uniform microstrip line width to improve S-pa...
- Patent number 12,003,010
- Issue date Jun 4, 2024
- NXP B.V.
- Lukas Frederik Tiemeijer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit device with built-in baluns
- Patent number 11,810,875
- Issue date Nov 7, 2023
- NXP B.V.
- Waqas Hassan Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topside heatsinking antenna launcher for an integrated circuit package
- Patent number 11,631,625
- Issue date Apr 18, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Topside heatsinking antenna launcher for an integrated circuit package
- Patent number 11,456,227
- Issue date Sep 27, 2022
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus comprising a semiconductor device and test app...
- Patent number 11,415,626
- Issue date Aug 16, 2022
- NXP B.V.
- Jan-Peter Schat
- G01 - MEASURING TESTING
Information Patent Grant
Bottom-side heatsinking waveguide for an integrated circuit package
- Patent number 11,276,654
- Issue date Mar 15, 2022
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 10,615,134
- Issue date Apr 7, 2020
- NXP B.V.
- Maristella Spella
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SLOT-CONFIGURATION DIE-TO-PACKAGE BALUN COUPLER
- Publication number 20250192078
- Publication date Jun 12, 2025
- NXP B.V.
- Waqas Hassan Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240395737
- Publication date Nov 28, 2024
- NXP B.V.
- Ralph Matthijs van Schelven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA UNIT AND METHOD OF PRODUCING AN ANTENNA UNIT
- Publication number 20240106105
- Publication date Mar 28, 2024
- NXP B.V.
- Waqas Hassan Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR BALUN WITH NON-UNIFORM MICROSTRIP LINE WIDTH TO IMPROVE S-PA...
- Publication number 20230198114
- Publication date Jun 22, 2023
- NXP B.V.
- Lukas Frederik Tiemeijer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOPSIDE HEATSINKING ANTENNA LAUNCHER FOR AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20220392821
- Publication date Dec 8, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICE WITH BUILT-IN BALUNS
- Publication number 20220328432
- Publication date Oct 13, 2022
- NXP B.V.
- Waqas Hassan Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS COMPRISING A SEMICONDUCTOR DEVICE AND TEST APP...
- Publication number 20210239754
- Publication date Aug 5, 2021
- NXP B.V.
- Jan-Peter Schat
- G01 - MEASURING TESTING
Information Patent Application
TopSide Heatsinking Antenna Launcher for an Integrated Circuit Package
- Publication number 20210183725
- Publication date Jun 17, 2021
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom-Side Heatsinking Waveguide for an Integrated Circuit Package
- Publication number 20210183797
- Publication date Jun 17, 2021
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20180233465
- Publication date Aug 16, 2018
- NXP B.V.
- Maristella SPELLA
- H01 - BASIC ELECTRIC ELEMENTS

Waqas Hassan SYED

Person

Patents Grantslast 30 patents

Planar balun with non-uniform microstrip line width to improve S-pa...

Packaged integrated circuit device with built-in baluns

Topside heatsinking antenna launcher for an integrated circuit package

Topside heatsinking antenna launcher for an integrated circuit package

Method and apparatus comprising a semiconductor device and test app...

Bottom-side heatsinking waveguide for an integrated circuit package

Integrated circuit package

Patents Applicationslast 30 patents

SLOT-CONFIGURATION DIE-TO-PACKAGE BALUN COUPLER

INTEGRATED CIRCUIT PACKAGE

ANTENNA UNIT AND METHOD OF PRODUCING AN ANTENNA UNIT

PLANAR BALUN WITH NON-UNIFORM MICROSTRIP LINE WIDTH TO IMPROVE S-PA...

TOPSIDE HEATSINKING ANTENNA LAUNCHER FOR AN INTEGRATED CIRCUIT PACKAGE

PACKAGED INTEGRATED CIRCUIT DEVICE WITH BUILT-IN BALUNS

METHOD AND APPARATUS COMPRISING A SEMICONDUCTOR DEVICE AND TEST APP...

TopSide Heatsinking Antenna Launcher for an Integrated Circuit Package

Bottom-Side Heatsinking Waveguide for an Integrated Circuit Package

INTEGRATED CIRCUIT PACKAGE