Ward Scott

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Electrically conductive fluid interconnects for integrated circuit...
- Patent number 7,939,945
- Issue date May 10, 2011
- Intel Corporation
- Ioan Sauciuc
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Loading mechanisms for integrated circuit (IC) packages
- Patent number 7,510,418
- Issue date Mar 31, 2009
- Intel Corporation
- Ward Scott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for dissipating heat from an electronic device
- Patent number 7,499,278
- Issue date Mar 3, 2009
- Intel Corporation
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and apparatus for dissipating heat from an electronic device
- Patent number 6,971,442
- Issue date Dec 6, 2005
- Intel Corporation
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY CONDUCTIVE FLUID INTERCONNECTS FOR INTEGRATED CIRCUIT...
- Publication number 20090273083
- Publication date Nov 5, 2009
- Ioan Sauciuc
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOADING MECHANISM FOR BARE DIE PACKAGES AND LGA SOCKET
- Publication number 20090085187
- Publication date Apr 2, 2009
- Ward Scott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for dissipating heat from an electronic device
- Publication number 20060005948
- Publication date Jan 12, 2006
- Intel Corporation
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Method and apparatus for dissipating heat from an electronic device
- Publication number 20030205364
- Publication date Nov 6, 2003
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL