Warren D. Dyckman

Person

Peekskill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure for an apparatus for monitoring and controlling heat gene...
- Patent number 8,214,660
- Issue date Jul 3, 2012
- International Business Machines Corporation
- Louis Bennie Capps, Jr.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method to optimize multi-core microprocessor performance...
- Patent number 7,721,119
- Issue date May 18, 2010
- International Business Machines Corporation
- Louis Bennie Capps, Jr.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for controlling heat generation in a multi-cor...
- Patent number 7,617,403
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Louis Bennie Capps, Jr.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for monitoring and controlling heat generation...
- Patent number 7,584,369
- Issue date Sep 1, 2009
- International Business Machines Corporation
- Louis Bennie Capps, Jr.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clearance hole size adjustment for impedance control in multilayer...
- Patent number 7,271,681
- Issue date Sep 18, 2007
- International Business Machines Corporation
- Warren D. Dyckman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
In-module current source
- Patent number 7,085,143
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Warren D. Dyckman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step transmission line for multilayer packaging
- Patent number 6,680,530
- Issue date Jan 20, 2004
- International Business Machines Corporation
- Edward R. Pillai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density thermal solution for direct attach modules
- Patent number 6,657,864
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Warren D. Dyckman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging with tapered striplines of constant im...
- Patent number 6,583,498
- Issue date Jun 24, 2003
- International Business Machine Corporation
- Edward R. Pillai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
OPTO-ELECTRONIC MODULE WITH IMPROVED LOW POWER, HIGH SPEED ELECTRIC...
- Publication number 20110206379
- Publication date Aug 25, 2011
- International Business Machines Corporation
- Russell A. Budd
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Design Structure For An Apparatus For Monitoring And Controlling He...
- Publication number 20090177445
- Publication date Jul 9, 2009
- International Business Machines Corporation
- Louis Bennie Capps, JR.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and Method to Optimize Multi-Core Microprocessor Performance...
- Publication number 20080052542
- Publication date Feb 28, 2008
- Louis Bennie Capps
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and Apparatus for Monitoring and Controlling Heat Generation...
- Publication number 20080028244
- Publication date Jan 31, 2008
- IBM Corporation
- Louis Bennie Capps
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and Apparatus for Controlling Heat Generation in a Multi-Cor...
- Publication number 20080028236
- Publication date Jan 31, 2008
- IBM Corporation
- Louis Bennie Capps
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLEARANCE HOLE SIZE ADJUSTMENT FOR IMPEDANCE CONTROL IN MULTILAYER...
- Publication number 20070008049
- Publication date Jan 11, 2007
- International Business Machines Corporation
- Warren D. Dyckman
- G06 - COMPUTING CALCULATING COUNTING

Warren D. Dyckman

Person

Patents Grantslast 30 patents

Structure for an apparatus for monitoring and controlling heat gene...

System and method to optimize multi-core microprocessor performance...

Method and apparatus for controlling heat generation in a multi-cor...

Method and apparatus for monitoring and controlling heat generation...

Clearance hole size adjustment for impedance control in multilayer...

In-module current source

Multi-step transmission line for multilayer packaging

High density thermal solution for direct attach modules

Integrated circuit packaging with tapered striplines of constant im...

Patents Applicationslast 30 patents

OPTO-ELECTRONIC MODULE WITH IMPROVED LOW POWER, HIGH SPEED ELECTRIC...

Design Structure For An Apparatus For Monitoring And Controlling He...

System and Method to Optimize Multi-Core Microprocessor Performance...

Method and Apparatus for Monitoring and Controlling Heat Generation...

Method and Apparatus for Controlling Heat Generation in a Multi-Cor...

CLEARANCE HOLE SIZE ADJUSTMENT FOR IMPEDANCE CONTROL IN MULTILAYER...