Warren L. Boyer

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 11,056,467
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 10,867,991
- Issue date Dec 15, 2020
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with post-probe configurability
- Patent number 10,811,372
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 10,483,241
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with post-probe configurability
- Patent number 10,403,585
- Issue date Sep 3, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with post-probe configurability
- Patent number 10,283,462
- Issue date May 7, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPACT DIGITAL THERMOMETER IN A MEMORY DEVICE
- Publication number 20240233839
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Chiara Cerafogli
- G11 - INFORMATION STORAGE
Information Patent Application
COMPACT DIGITAL THERMOMETER IN A MEMORY DEVICE
- Publication number 20240136000
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Chiara Cerafogli
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY
- Publication number 20200212032
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH THROUGH SILICON VIAS AND PACKAGE-LEVEL C...
- Publication number 20200035650
- Publication date Jan 30, 2020
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH POST-PROBE CONFIGURABILITY
- Publication number 20190273052
- Publication date Sep 5, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH POST-PROBE CONFIGURABILITY
- Publication number 20190148314
- Publication date May 16, 2019
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS