Warren T. Yu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Exposure correction based on reflective index for photolithographic...
- Patent number 6,482,573
- Issue date Nov 19, 2002
- Advanced Micro Devices, Inc.
- Jayendra D. Bhakta
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of using critical dimension mapping to optimize speed perfor...
- Patent number 6,345,211
- Issue date Feb 5, 2002
- Advanced Micro Devices, Inc.
- Warren T. Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of using critical dimension mapping to qualify a new integra...
- Patent number 6,345,209
- Issue date Feb 5, 2002
- Advanced Micro Devices, Inc.
- Warren T. Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of using critical dimension mapping to qualify a reticle use...
- Patent number 6,345,210
- Issue date Feb 5, 2002
- Advanced Micro Devices, Inc.
- Warren T. Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of using critical dimension mapping to qualify a new integra...
- Patent number 6,238,936
- Issue date May 29, 2001
- Advanced Micro Devices, Inc.
- Warren T. Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of using critical dimension mapping to qualify a new integra...
- Patent number 6,215,127
- Issue date Apr 10, 2001
- Advanced Micro Devices, Inc.
- Warren T. Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
ETCH BIAS TUNING FOR ENHANCEMENT OF STEPPER LIFE
- Publication number 20010003673
- Publication date Jun 14, 2001
- WARREN T. YU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Warren T. Yu

Person

Patents Grantslast 30 patents

Exposure correction based on reflective index for photolithographic...

Method of using critical dimension mapping to optimize speed perfor...

Method of using critical dimension mapping to qualify a new integra...

Method of using critical dimension mapping to qualify a reticle use...

Method of using critical dimension mapping to qualify a new integra...

Method of using critical dimension mapping to qualify a new integra...

Patents Applicationslast 30 patents

ETCH BIAS TUNING FOR ENHANCEMENT OF STEPPER LIFE