Wataru Kaneda

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,430,725
- Issue date Aug 30, 2022
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 10,978,383
- Issue date Apr 13, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor package, and semiconductor device
- Patent number 9,780,043
- Issue date Oct 3, 2017
- Shinko Electric Industries Co., Ltd.
- Wataru Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 9,565,775
- Issue date Feb 7, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,455,219
- Issue date Sep 27, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 9,380,707
- Issue date Jun 28, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,148,952
- Issue date Sep 29, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method for manufacturing wi...
- Patent number 9,119,319
- Issue date Aug 25, 2015
- Shinko Electric Industries Co., Ltd.
- Wataru Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,000,302
- Issue date Apr 7, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210202361
- Publication date Jul 1, 2021
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR DEVICE
- Publication number 20170170130
- Publication date Jun 15, 2017
- Shinko Electric Industries Co., Ltd.
- Wataru Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150282323
- Publication date Oct 1, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20150163899
- Publication date Jun 11, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WI...
- Publication number 20150102510
- Publication date Apr 16, 2015
- Shinko Electric Industries Co., Ltd.
- Wataru Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
- Publication number 20150062851
- Publication date Mar 5, 2015
- Shinko Electric Industries Co., LTD.
- Noriyoshi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140311771
- Publication date Oct 23, 2014
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140225275
- Publication date Aug 14, 2014
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Wiring Substrate
- Publication number 20140150258
- Publication date Jun 5, 2014
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS

Wataru Kaneda

Person

Patents Grantslast 30 patents

Wiring board and method of manufacturing the same

Wiring board and method of manufacturing the same

Wiring board, semiconductor package, and semiconductor device

Wiring board, semiconductor device, and method of manufacturing wir...

Wiring substrate and method of manufacturing the same

Method of manufacturing wiring substrate

Wiring board

Wiring board, semiconductor device, and method for manufacturing wi...

Wiring board

Patents Applicationslast 30 patents

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR DEVICE

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WI...

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...

WIRING BOARD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Method of Manufacturing Wiring Substrate