Wayne H. Huang

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,735,549
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-last methods for forming semiconductor devices
- Patent number 11,631,630
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package cooling by coil cavity
- Patent number 11,239,129
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of removing particles from over semiconductor substrates
- Patent number 11,139,159
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Joseph Neil Greeley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,081,460
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-last methods for forming semiconductor devices
- Patent number 10,957,625
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package cooling by coil cavity
- Patent number 10,763,186
- Issue date Sep 1, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform back side exposure of through-silicon vias
- Patent number 10,692,733
- Issue date Jun 23, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform back side exposure of through-silicon vias
- Patent number 10,410,879
- Issue date Sep 10, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through-silicon-via and methods of form...
- Patent number 10,262,922
- Issue date Apr 16, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of removing particles from over semiconductor substrates
- Patent number 10,137,481
- Issue date Nov 27, 2018
- Micron Technology, Inc.
- Joseph Neil Greeley
- B08 - CLEANING
Information Patent Grant
Semiconductor device having through-silicon-via and methods of form...
- Patent number 9,941,190
- Issue date Apr 10, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with improved conductive properties and asso...
- Patent number 9,837,383
- Issue date Dec 5, 2017
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform back side exposure of through-silicon vias
- Patent number 9,818,622
- Issue date Nov 14, 2017
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 9,780,052
- Issue date Oct 3, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with improved conductive properties and asso...
- Patent number 9,412,675
- Issue date Aug 9, 2016
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with underfill containment cavity
- Patent number 9,397,078
- Issue date Jul 19, 2016
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a planar surface for a semiconductor device struc...
- Patent number 9,153,451
- Issue date Oct 6, 2015
- Micron Technology, Inc.
- Andrew Dennis Watson Carswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of planarization and electro-chemical mechanical polishing...
- Patent number 8,974,655
- Issue date Mar 10, 2015
- Micron Technology, Inc.
- Wayne Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices, systems, and methods related to planarizing semiconductor...
- Patent number 8,956,974
- Issue date Feb 17, 2015
- Micron Technology, Inc.
- Wayne H. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of removing particles from over semiconductor substrates
- Patent number 8,940,102
- Issue date Jan 27, 2015
- Micron Technology, Inc.
- Neil Joseph Greeley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a programmable region that comprises a multivale...
- Patent number 8,809,157
- Issue date Aug 19, 2014
- Micron Technology, Inc.
- D. V. Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a memory cell having programmable material that...
- Patent number 8,633,084
- Issue date Jan 21, 2014
- Micron Technology, Inc.
- D. V. Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of removing particles from over semiconductor substrates
- Patent number 8,226,772
- Issue date Jul 24, 2012
- Micron Technology, Inc.
- Neil Joseph Greeley
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...
- Publication number 20210343670
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES
- Publication number 20210166996
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COOLING BY COIL CAVITY
- Publication number 20200395258
- Publication date Dec 17, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...
- Publication number 20200211993
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COOLING BY COIL CAVITY
- Publication number 20200211916
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM BACK SIDE EXPOSURE OF THROUGH-SILICON VIAS
- Publication number 20190304799
- Publication date Oct 3, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES
- Publication number 20190206766
- Publication date Jul 4, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Removing Particles from Over Semiconductor Substrates
- Publication number 20190047025
- Publication date Feb 14, 2019
- Micron Technology, Inc.
- Joseph Neil Greeley
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON-VIA AND METHODS OF FORM...
- Publication number 20180190571
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...
- Publication number 20180040592
- Publication date Feb 8, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM BACK SIDE EXPOSURE OF THROUGH-SILICON VIAS
- Publication number 20180033641
- Publication date Feb 1, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20170352633
- Publication date Dec 7, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20170077052
- Publication date Mar 16, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...
- Publication number 20160343689
- Publication date Nov 24, 2016
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON-VIA AND METHODS OF FORM...
- Publication number 20160293519
- Publication date Oct 6, 2016
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM BACK SIDE EXPOSURE OF THROUGH-SILICON VIAS
- Publication number 20160225695
- Publication date Aug 4, 2016
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...
- Publication number 20150333026
- Publication date Nov 19, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS, AND METHODS RELATED TO PLANARIZING SEMICONDUCTOR...
- Publication number 20150206801
- Publication date Jul 23, 2015
- Micron Technology, Inc.
- Wayne H. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Removing Particles from Over Semiconductor Substrates
- Publication number 20150128992
- Publication date May 14, 2015
- Micron Technology, Inc.
- Joseph Neil Greeley
- B08 - CLEANING
Information Patent Application
METHOD OF FORMING A PLANAR SURFACE FOR A SEMICONDUCTOR DEVICE STRUC...
- Publication number 20140162455
- Publication date Jun 12, 2014
- Micron Technology, Inc.
- Andrew Dennis Watson Carswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming A Programmable Region That Comprises A Multivale...
- Publication number 20140106534
- Publication date Apr 17, 2014
- Micron Technology, Inc.
- D.V. Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS, AND METHODS RELATED TO PLANARIZING SEMICONDUCTOR...
- Publication number 20140004698
- Publication date Jan 2, 2014
- Micron Technology, Inc.
- Wayne H. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrates Comprising Integrated Circuitry, Methods Of Processing A...
- Publication number 20130313718
- Publication date Nov 28, 2013
- Micron Technology, Inc.
- Sony Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Removing Particles From Over Semiconductor Substrates
- Publication number 20120266913
- Publication date Oct 25, 2012
- Micron Technology, Inc.
- Neil Joseph Greeley
- B08 - CLEANING
Information Patent Application
Methods of Removing Particles From Over Semiconductor Substrates
- Publication number 20100170531
- Publication date Jul 8, 2010
- Neil Joseph Greeley
- B08 - CLEANING
Information Patent Application
Methods of Planarization and Electro-Chemical Mechanical Polishing...
- Publication number 20090239379
- Publication date Sep 24, 2009
- Wayne Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Wayne H. Huang

Person

Patents Grantslast 30 patents

Methods and systems for manufacturing pillar structures on semicond...

Pillar-last methods for forming semiconductor devices

Package cooling by coil cavity

Methods of removing particles from over semiconductor substrates

Methods and systems for manufacturing pillar structures on semicond...

Pillar-last methods for forming semiconductor devices

Collars for under-bump metal structures and associated systems and...

Package cooling by coil cavity

Uniform back side exposure of through-silicon vias

Uniform back side exposure of through-silicon vias

Semiconductor device having through-silicon-via and methods of form...

Methods of removing particles from over semiconductor substrates

Semiconductor device having through-silicon-via and methods of form...

Interconnect structure with improved conductive properties and asso...

Uniform back side exposure of through-silicon vias

Collars for under-bump metal structures and associated systems and...

Interconnect structure with improved conductive properties and asso...

Semiconductor device assembly with underfill containment cavity

Method of forming a planar surface for a semiconductor device struc...

Methods of planarization and electro-chemical mechanical polishing...

Devices, systems, and methods related to planarizing semiconductor...

Methods of removing particles from over semiconductor substrates

Methods of forming a programmable region that comprises a multivale...

Methods of forming a memory cell having programmable material that...

Methods of removing particles from over semiconductor substrates

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...

PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

PACKAGE COOLING BY COIL CAVITY

METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICOND...

PACKAGE COOLING BY COIL CAVITY

UNIFORM BACK SIDE EXPOSURE OF THROUGH-SILICON VIAS

PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES

Methods of Removing Particles from Over Semiconductor Substrates

SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON-VIA AND METHODS OF FORM...

INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...

UNIFORM BACK SIDE EXPOSURE OF THROUGH-SILICON VIAS

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...

SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON-VIA AND METHODS OF FORM...

UNIFORM BACK SIDE EXPOSURE OF THROUGH-SILICON VIAS

INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...

DEVICES, SYSTEMS, AND METHODS RELATED TO PLANARIZING SEMICONDUCTOR...

Methods of Removing Particles from Over Semiconductor Substrates

METHOD OF FORMING A PLANAR SURFACE FOR A SEMICONDUCTOR DEVICE STRUC...

Methods Of Forming A Programmable Region That Comprises A Multivale...

DEVICES, SYSTEMS, AND METHODS RELATED TO PLANARIZING SEMICONDUCTOR...

Substrates Comprising Integrated Circuitry, Methods Of Processing A...

Methods Of Removing Particles From Over Semiconductor Substrates

Methods of Removing Particles From Over Semiconductor Substrates

Methods of Planarization and Electro-Chemical Mechanical Polishing...