Wayne K. Pfaff

Person

Irving, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Test mounting for grid array packages
- Patent number 6,367,763
- Issue date Apr 9, 2002
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Test mounting for surface mount device packages
- Patent number 6,294,920
- Issue date Sep 25, 2001
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Mounting for high frequency device packages
- Patent number 6,270,357
- Issue date Aug 7, 2001
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Test socket for surface mount device packages
- Patent number 6,124,720
- Issue date Sep 26, 2000
- Plastronics Socket Company, Inc.
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Mounting apparatus for grid array packages
- Patent number 6,016,254
- Issue date Jan 18, 2000
- Wayne K. Pfaff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus for ball grid array device
- Patent number 5,611,705
- Issue date Mar 18, 1997
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Mounting apparatus for ball grid array device
- Patent number 5,556,293
- Issue date Sep 17, 1996
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Automated closure test socket
- Patent number 5,508,628
- Issue date Apr 16, 1996
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Mounting apparatus for ball grid array device
- Patent number 5,419,710
- Issue date May 30, 1995
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Test socket
- Patent number 5,108,302
- Issue date Apr 28, 1992
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Test socket for electronic device packages
- Patent number 4,950,980
- Issue date Aug 21, 1990
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Cradle for electronic device package
- Patent number 4,869,674
- Issue date Sep 26, 1989
- Wayne K. Pfaff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero insertion force mounting housings for electronic device packages
- Patent number 4,808,119
- Issue date Feb 28, 1989
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Test fixture for electronic device packages
- Patent number 4,767,983
- Issue date Aug 30, 1988
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Socket for flat pack electronic device packages
- Patent number 4,713,022
- Issue date Dec 15, 1987
- Wayne K. Pfaff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for unloading electronic circuit packages from...
- Patent number 4,660,282
- Issue date Apr 28, 1987
- Wayne K. Pfaff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low insertion force socket
- Patent number 4,618,199
- Issue date Oct 21, 1986
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Mounting housing for leadless chip carrier
- Patent number 4,491,377
- Issue date Jan 1, 1985
- Wayne K. Pfaff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit package handling apparatus
- Patent number 4,370,805
- Issue date Feb 1, 1983
- Plastronics Interconnections, Inc.
- Wayne K. Pfaff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit package loader and extractor
- Patent number 4,304,514
- Issue date Dec 8, 1981
- Thermalloy Incorporated
- Wayne K. Pfaff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting pad and semiconductor encapsulation device combination
- Patent number 3,962,719
- Issue date Jun 8, 1976
- Plastronics, Inc.
- Wayne K. Pfaff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Wayne K. Pfaff

Person

Patents Grantslast 30 patents

Test mounting for grid array packages

Test mounting for surface mount device packages

Mounting for high frequency device packages

Test socket for surface mount device packages

Mounting apparatus for grid array packages

Mounting apparatus for ball grid array device

Mounting apparatus for ball grid array device

Automated closure test socket

Mounting apparatus for ball grid array device

Test socket

Test socket for electronic device packages

Cradle for electronic device package

Zero insertion force mounting housings for electronic device packages

Test fixture for electronic device packages

Socket for flat pack electronic device packages

Method and apparatus for unloading electronic circuit packages from...

Low insertion force socket

Mounting housing for leadless chip carrier

Circuit package handling apparatus

Circuit package loader and extractor

Mounting pad and semiconductor encapsulation device combination