Wee Aun Jason Lim

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Topside-cooled semiconductor package with molded standoff
- Patent number 11,239,127
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Edward Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package and method for fabricating a power semi...
- Patent number 11,211,356
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGE HAVING AN ELECTRICALLY CONDUCTIVE CLIP WITH A CONVEX...
- Publication number 20240087993
- Publication date Mar 14, 2024
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOPSIDE-COOLED SEMICONDUCTOR PACKAGE WITH MOLDED STANDOFF
- Publication number 20210398867
- Publication date Dec 23, 2021
- INFINEON TECHNOLOGIES AG
- Edward MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package and Method for Fabricating a Power Semi...
- Publication number 20210057375
- Publication date Feb 25, 2021
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS