Wee Boon Tay

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Topside-cooled semiconductor package with molded standoff
- Patent number 11,239,127
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Edward Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect clip with angled contact surface and raised bridge
- Patent number 11,183,451
- Issue date Nov 23, 2021
- Infineon Technologies AG
- Chai Chee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated leadless package having an at least partially exposed...
- Patent number 10,978,378
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having contact pins at short side edges
- Patent number 10,037,934
- Issue date Jul 31, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip testing of semiconductor devices
- Patent number 9,728,492
- Issue date Aug 8, 2017
- Infineon Technologies AG
- Thiong Zhou See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder barrier
- Patent number 9,640,459
- Issue date May 2, 2017
- Infineon Technologies AG
- Wee Boon Tay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20230095545
- Publication date Mar 30, 2023
- Paul Armand Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AN ELECTRICAL CONNECTION STRUCTURE AND AN ELECTRONIC DEVICE INCLUDI...
- Publication number 20220173020
- Publication date Jun 2, 2022
- Wee Boon Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOPSIDE-COOLED SEMICONDUCTOR PACKAGE WITH MOLDED STANDOFF
- Publication number 20210398867
- Publication date Dec 23, 2021
- INFINEON TECHNOLOGIES AG
- Edward MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Clip with Angled Contact Surface and Raised Bridge Tec...
- Publication number 20210074667
- Publication date Mar 11, 2021
- Chai Chee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Clip with Angled Contact Surface and Raised Bridge
- Publication number 20210074628
- Publication date Mar 11, 2021
- Chai Chee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Leadless Package Having an at Least Partially Exposed...
- Publication number 20190189542
- Publication date Jun 20, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having Contact Pins at Short Side Edges
- Publication number 20160233149
- Publication date Aug 11, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Wee Boon Tay

Person

Patents Grantslast 30 patents

Topside-cooled semiconductor package with molded standoff

Interconnect clip with angled contact surface and raised bridge

Encapsulated leadless package having an at least partially exposed...

Semiconductor chip package having contact pins at short side edges

Strip testing of semiconductor devices

Semiconductor device including a solder barrier

Patents Applicationslast 30 patents

Semiconductor Packages and Methods for Manufacturing Thereof

AN ELECTRICAL CONNECTION STRUCTURE AND AN ELECTRONIC DEVICE INCLUDI...

TOPSIDE-COOLED SEMICONDUCTOR PACKAGE WITH MOLDED STANDOFF

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Interconnect Clip with Angled Contact Surface and Raised Bridge Tec...

Interconnect Clip with Angled Contact Surface and Raised Bridge

Encapsulated Leadless Package Having an at Least Partially Exposed...

Semiconductor Chip Package Having Contact Pins at Short Side Edges