Wei Boon WONG

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method of recovering a bonding apparatus from a bonding failure
- Patent number 9,314,869
- Issue date Apr 19, 2016
- ASM Technology Singapore Pte. Ltd.
- Wai Wah Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF RECOVERING A BONDING APPARATUS FROM A BONDING FAILURE
- Publication number 20130180957
- Publication date Jul 18, 2013
- ASM Technology Singapore Pte Ltd
- Wai Wah LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR