Wei CHEN

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Patents Grantslast 30 patents

Information Patent Grant
Palladium (Pd)-coated copper wire for ball bonding
- Patent number 10,195,697
- Issue date Feb 5, 2019
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for high-speed signal line
- Patent number 9,972,595
- Issue date May 15, 2018
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver—gold alloy bonding wire
- Patent number 9,362,249
- Issue date Jun 7, 2016
- Tanaka Denshi Kogyo K.K.
- Kazuhiko Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...
- Publication number 20220005781
- Publication date Jan 6, 2022
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE METAL-COATED COPPER WIRE FOR BALL BONDING
- Publication number 20170125135
- Publication date May 4, 2017
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM (PD)-COATED COPPER WIRE FOR BALL BONDING
- Publication number 20170057020
- Publication date Mar 2, 2017
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER-GOLD ALLOY BONDING WIRE
- Publication number 20160093586
- Publication date Mar 31, 2016
- TANAKA DENSHI KOGYO K.K.
- Kazuhiko YASUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR HIGH-SPEED SIGNAL LINE
- Publication number 20140302317
- Publication date Oct 9, 2014
- TANAKA DENSHI KOGYO K.K.
- Yuki ANTOKU
- H01 - BASIC ELECTRIC ELEMENTS