Wei-Cheng Chu

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid metal line structure
- Patent number 12,183,671
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having deep metal line and method for formi...
- Patent number 12,094,816
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of operating the same
- Patent number 12,058,852
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 12,002,709
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,860,550
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,764,106
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of operating the same
- Patent number 11,729,969
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid metal line structure
- Patent number 11,682,618
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,422,475
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with self-aligned conductiv...
- Patent number 11,404,367
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,183,422
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 11,107,725
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of interconnection structure of semi...
- Patent number 11,088,020
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,991,618
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing with flexible space formed using self-aligned spacer...
- Patent number 10,957,580
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with graphene layer
- Patent number 10,818,596
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 10,804,143
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-align patterning
- Patent number 10,784,155
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 10,784,151
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing with flexible space formed using self-aligned spacer...
- Patent number 10,734,275
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with self-al...
- Patent number 10,714,421
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 10,534,273
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Interconnection structure of semiconductor device
- Patent number 10,535,560
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing with flexible space formed using self-aligned spacer...
- Patent number 10,529,617
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split rail structures located in adjacent metal layers
- Patent number 10,522,469
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Tien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-align patterning
- Patent number 10,483,159
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including air gap
- Patent number 10,340,181
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with damascene structure
- Patent number 10,276,396
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear transmission device with lubrication unit
- Patent number 10,267,408
- Issue date Apr 23, 2019
- Hiwin Technologies Corp.
- Chao-Yuan Kang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Split rail structures located in adjacent metal layers
- Patent number 10,269,715
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Tien Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...
- Publication number 20240379537
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20240085803
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230369096
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20230309296
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID METAL LINE STRUCTURE
- Publication number 20230282571
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20230262968
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...
- Publication number 20230067527
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIVE FEATURES
- Publication number 20220359380
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Metal Fill with Self-Aligned Patterning and Dielectric with V...
- Publication number 20220350262
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METAL LINE STRUCTURE
- Publication number 20220310508
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210391211
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20210242076
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20210066120
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210035853
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210005510
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...
- Publication number 20200365449
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIV...
- Publication number 20200343180
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...
- Publication number 20200144104
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20200124985
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200083093
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Metal Fill with Self-Align Patterning
- Publication number 20200051853
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190326157
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT RAIL STRUCTURES LOCATED IN ADJACENT METAL LAYERS
- Publication number 20190244902
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Tien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...
- Publication number 20190103305
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SELF-AL...
- Publication number 20190067187
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMI...
- Publication number 20190067089
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTURE
- Publication number 20190043730
- Publication date Feb 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMI...
- Publication number 20190027406
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20190019753
- Publication date Jan 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGN PATTERNING
- Publication number 20180308749
- Publication date Oct 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS

Wei-Cheng Chu

Person

Patents Grantslast 30 patents

Hybrid metal line structure

Semiconductor structure having deep metal line and method for formi...

Semiconductor device and method of operating the same

Interconnect structure and manufacturing method for the same

Multi-metal fill with self-aligned patterning and dielectric with v...

Semiconductor device and method of manufacture

Semiconductor device and method of operating the same

Hybrid metal line structure

Multi-metal fill with self-aligned patterning and dielectric with v...

Method for forming semiconductor device with self-aligned conductiv...

Semiconductor structure and method for manufacturing the same

Interconnect structure and manufacturing method for the same

Structure and formation method of interconnection structure of semi...

Semiconductor device and method of manufacture

Metal routing with flexible space formed using self-aligned spacer...

Method for forming semiconductor device structure with graphene layer

Semiconductor structure and method for manufacturing the same

Multi-metal fill with self-align patterning

Interconnect structure and manufacturing method for the same

Metal routing with flexible space formed using self-aligned spacer...

Structure and formation method of semiconductor device with self-al...

Multi-metal fill with self-aligned patterning and dielectric with v...

Interconnection structure of semiconductor device

Metal routing with flexible space formed using self-aligned spacer...

Split rail structures located in adjacent metal layers

Multi-metal fill with self-align patterning

Interconnect structure including air gap

Method for forming semiconductor device with damascene structure

Linear transmission device with lubrication unit

Split rail structures located in adjacent metal layers

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME

HYBRID METAL LINE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME

SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIVE FEATURES

Multi-Metal Fill with Self-Aligned Patterning and Dielectric with V...

HYBRID METAL LINE STRUCTURE

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...

METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIV...

Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Multi-Metal Fill with Self-Align Patterning

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SPLIT RAIL STRUCTURES LOCATED IN ADJACENT METAL LAYERS

Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SELF-AL...

STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMI...

METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTURE

STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMI...

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

MULTI-METAL FILL WITH SELF-ALIGN PATTERNING