Wei Chi YIH

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level semiconductor device packages with electromagnetic inte...
- Patent number 8,378,466
- Issue date Feb 19, 2013
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and semiconductor package
- Patent number 8,110,931
- Issue date Feb 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for packaging a semiconductor package
- Patent number 8,076,786
- Issue date Dec 13, 2011
- Advanced Semiconductor Engineering, Inc.
- Chang Ying Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for processing and bonding a wire
- Patent number 8,053,906
- Issue date Nov 8, 2011
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method for enhancing the bond of a bonding w...
- Patent number 8,018,075
- Issue date Sep 13, 2011
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer-Level Semiconductor Device Packages with Electromagnetic Inte...
- Publication number 20110115060
- Publication date May 19, 2011
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR PACKAGE STRUCTURE
- Publication number 20100184255
- Publication date Jul 22, 2010
- Chien LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
- Publication number 20100007004
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD FOR ENHANCING THE BOND OF A BONDING W...
- Publication number 20100007010
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE
- Publication number 20100007009
- Publication date Jan 14, 2010
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PACKAGING A SEMICONDUCTOR PACKAGE
- Publication number 20100007011
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Chang Ying HUNG
- H01 - BASIC ELECTRIC ELEMENTS