Wei Chun Ang

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with thermal structures and met...
- Patent number 8,963,320
- Issue date Feb 24, 2015
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THERMAL STRUCTURES AND MET...
- Publication number 20130087902
- Publication date Apr 11, 2013
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS