Wei-Chun Kung

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Process and structure for semiconductor package
- Patent number 7,005,327
- Issue date Feb 28, 2006
- Advanced Semiconductor Engineering, Inc.
- Wei-Chun Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate strip for use in packaging semiconductor chips and method...
- Patent number 6,482,675
- Issue date Nov 19, 2002
- Advanced Semiconductor Engineering Inc.
- Kao-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate strip for use in packaging semiconductor chips
- Patent number 6,262,490
- Issue date Jul 17, 2001
- Advanced Semiconductor Engineering, Inc.
- Kao-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
[PROCESS AND STRUCTURE FOR SEMICONDUCTOR PACKAGE]
- Publication number 20040115862
- Publication date Jun 17, 2004
- WEI-CHUN KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate strip for use in packaging semiconductor chips and method...
- Publication number 20010049159
- Publication date Dec 6, 2001
- Advanced Semiconductor Engineering, Inc.
- Kao-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS