Wei Fen Sueann LIM

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Solder surface features for integrated circuit packages
- Patent number 12,021,011
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal semiconductor package molds
- Patent number 11,791,170
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 11,742,263
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting a leadframe assembly with a plurality of punching tools
- Patent number 11,626,350
- Issue date Apr 11, 2023
- Texas Instruments Incorporated
- Chong Han Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with lead pitch gap
- Patent number 11,569,152
- Issue date Jan 31, 2023
- Texas Instruments Incorporated
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with step cut lead
- Patent number 11,502,045
- Issue date Nov 15, 2022
- Texas Instruments Incorporated
- Amirul Afiq bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe strip
- Patent number 11,373,940
- Issue date Jun 28, 2022
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making a flat no-lead package with exposed electroplated side lead...
- Patent number 11,348,806
- Issue date May 31, 2022
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Locking dual leadframe for flip chip on leadframe packages
- Patent number 11,056,462
- Issue date Jul 6, 2021
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 10,879,154
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe strip
- Patent number 10,784,190
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of assembling a flip chip on a locking dual leadframe
- Patent number 10,541,225
- Issue date Jan 21, 2020
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe strip with vertically offset die attach pads between adja...
- Patent number 10,115,660
- Issue date Oct 30, 2018
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having leadframe features preventing...
- Patent number 9,892,936
- Issue date Feb 13, 2018
- Texas Instruments Incorporated
- Wei Fen Sueann Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly
- Patent number 9,842,807
- Issue date Dec 12, 2017
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH HIGH DRAFT ANGLE PACKAGE STRUCTURE
- Publication number 20230361008
- Publication date Nov 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Wei Fen Sueann Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER SURFACE FEATURES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20230069741
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- AMIRUL AFIQ BIN HUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS
- Publication number 20210242038
- Publication date Aug 5, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Anis Fauzi BIN ABDUL AZIZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME ASSEMBLY
- Publication number 20210202356
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Chong Han LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flippable Leadframe for Packaged Electronic System Having Verticall...
- Publication number 20210074613
- Publication date Mar 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS
- Publication number 20210043466
- Publication date Feb 11, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Anis Fauzi BIN ABDUL AZIZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING LEADFRAME STRIP
- Publication number 20210005540
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH STEP CUT LEAD
- Publication number 20200235057
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Amirul Afiq bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH LEAD PITCH GAP
- Publication number 20200235042
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK
- Publication number 20200176365
- Publication date Jun 4, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Bin Abdul Aziz Anis Fauzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK
- Publication number 20190206770
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Bin Abdul Aziz Anis Fauzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Leadframe With Pressure-Absorbing Pad S...
- Publication number 20180122724
- Publication date May 3, 2018
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...
- Publication number 20170358523
- Publication date Dec 14, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20170345790
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...
- Publication number 20170345743
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20170309595
- Publication date Oct 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO LEVEL LEADFRAME WITH UPSET BALL BONDING SURFACE AND DEVICE PACKAGE
- Publication number 20130127029
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene LEE
- H01 - BASIC ELECTRIC ELEMENTS

Wei Fen Sueann LIM

Person

Patents Grantslast 30 patents

Solder surface features for integrated circuit packages

Universal semiconductor package molds

Flippable leadframe for packaged electronic system having verticall...

Cutting a leadframe assembly with a plurality of punching tools

Electronic device with lead pitch gap

Electronic device with step cut lead

Method of making leadframe strip

Making a flat no-lead package with exposed electroplated side lead...

Locking dual leadframe for flip chip on leadframe packages

Flippable leadframe for packaged electronic system having verticall...

Method of making leadframe strip

Methods of assembling a flip chip on a locking dual leadframe

Leadframe strip with vertically offset die attach pads between adja...

Packaged semiconductor device having leadframe features preventing...

Integrated circuit assembly

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH HIGH DRAFT ANGLE PACKAGE STRUCTURE

SOLDER SURFACE FEATURES FOR INTEGRATED CIRCUIT PACKAGES

UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS

LEADFRAME ASSEMBLY

Flippable Leadframe for Packaged Electronic System Having Verticall...

UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS

METHOD OF MAKING LEADFRAME STRIP

ELECTRONIC DEVICE WITH STEP CUT LEAD

ELECTRONIC DEVICE WITH LEAD PITCH GAP

INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK

INTEGRATED CIRCUIT PACKAGE WITH LEAD LOCK

Semiconductor Device Having Leadframe With Pressure-Absorbing Pad S...

LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES

LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJA...

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES

TWO LEVEL LEADFRAME WITH UPSET BALL BONDING SURFACE AND DEVICE PACKAGE