Wei-Feng Tsai

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Cavity-backed slot antenna system
- Patent number 12,237,577
- Issue date Feb 25, 2025
- ASUSTeK COMPUTER Inc.
- Shih-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,218,082
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touchpad assembly
- Patent number 12,189,884
- Issue date Jan 7, 2025
- TPK Advanced Solutions Inc.
- Cai Jin Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device, method of and system for manufacturing semico...
- Patent number 12,176,338
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hsin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, system and method of forming the same
- Patent number 12,080,647
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for detecting cancerous cells
- Patent number 12,053,777
- Issue date Aug 6, 2024
- Academia Sinica
- Shang-Cheng Hung
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device, method of and system for manufacturing semico...
- Patent number 11,855,070
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hsin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device, package structure and fabricating method thereof
- Patent number 11,855,006
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Medium passage switching mechanism disposed on a casing of an image...
- Patent number 11,827,477
- Issue date Nov 28, 2023
- Avision Inc.
- Wei-Lun Tsai
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Medium passage switching mechanism and related image forming device
- Patent number 11,827,483
- Issue date Nov 28, 2023
- Avision Inc.
- Wei-Lun Tsai
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Electronic package and circuit structure thereof
- Patent number 11,791,300
- Issue date Oct 17, 2023
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming shield structure for backside through substrate v...
- Patent number 11,764,129
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airflow detection device for detecting whether air output path is o...
- Patent number 11,733,076
- Issue date Aug 22, 2023
- Alpha Networks Inc.
- Wei-Hung Tsai
- G01 - MEASURING TESTING
Information Patent Grant
Three-dimensional touch module and detection method thereof
- Patent number 11,720,197
- Issue date Aug 8, 2023
- TPK TOUCH SOLUTIONS (XIAMEN) INC.
- Cai Jin Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image forming device with a collapsible guiding mechanism
- Patent number 11,673,412
- Issue date Jun 13, 2023
- Avision Inc.
- Wei-Lun Tsai
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Touch display apparatus, driver integrated circuit and touch displa...
- Patent number 11,573,653
- Issue date Feb 7, 2023
- Novatek Microelectronics Corp.
- Wei-Kang Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit, system and method of forming the same
- Patent number 11,569,168
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting cholangiocarcinoma cells
- Patent number 11,549,946
- Issue date Jan 10, 2023
- National Tsing Hua University
- Gwo Bin Lee
- G01 - MEASURING TESTING
Information Patent Grant
Three-dimensional sensing module and method of manufacturing the sa...
- Patent number 11,520,429
- Issue date Dec 6, 2022
- TPK Advanced Solutions Inc.
- Lien Hsin Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic curtain and electronic device
- Patent number 11,493,809
- Issue date Nov 8, 2022
- TPK Advanced Solutions Inc.
- Tsai Kuei Wei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Forming STI regions to separate semiconductor Fins
- Patent number 11,450,661
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with separated street between chips
- Patent number 11,444,058
- Issue date Sep 13, 2022
- Novatek Microelectronics Corp.
- Chien-Chen Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-common-ground bandpass filter circuit with electrostatic discha...
- Patent number 11,438,992
- Issue date Sep 6, 2022
- iWAVE TECHNOLOGIES CO., LTD.
- Shau-Gang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Analog-to-digital converter device equipped with conversion suspens...
- Patent number 11,418,207
- Issue date Aug 16, 2022
- Artery Technology Co., Ltd.
- Zhengxiang Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chemical mechanical polishing method
- Patent number 11,339,308
- Issue date May 24, 2022
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Wei-Wen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch sensing layer and touch panel
- Patent number 11,327,620
- Issue date May 10, 2022
- TPK ADVANCED SOLUTIONS INC.
- Caijin Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit
- Patent number 11,264,378
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensing module, touch panel and method of detecting two-po...
- Patent number 11,243,633
- Issue date Feb 8, 2022
- TPK ADVANCED SOLUTIONS INC.
- Ho-Hsun Chi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for positioning and tracking using a plurality of...
- Patent number 11,246,010
- Issue date Feb 8, 2022
- iWAVE TECHNOLOGIES CO., LTD.
- Shau-Gang Mao
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER CHUCK INCLUDING SELF-SEALING VACUUM SEAL ASSEMBLIES AND METHO...
- Publication number 20250079228
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072119
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hsin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOUCHPAD ASSEMBLY
- Publication number 20250060842
- Publication date Feb 20, 2025
- TPK ADVANCED SOLUTIONS INC.
- Cai-Jin Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR ISOLATION PROCESS CONTROL AND STRUCTURES THEREOF
- Publication number 20240404871
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Wei Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME
- Publication number 20240371768
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240321901
- Publication date Sep 26, 2024
- E Ink Holdings Inc.
- Hsien-Kai TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20240312889
- Publication date Sep 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20240297193
- Publication date Sep 5, 2024
- VisEra Technologies Company Limited
- Wei-Lung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222290
- Publication date Jul 4, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT BENDABLE CASE HAVING A SUPPORT MECHANISM
- Publication number 20240197050
- Publication date Jun 20, 2024
- Wei-Yin Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCHPAD ASSEMBLY
- Publication number 20240176440
- Publication date May 30, 2024
- TPK ADVANCED SOLUTIONS INC.
- Cai Jin Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSOR
- Publication number 20240121972
- Publication date Apr 11, 2024
- VisEra Technologies Company Limited
- Wei-Lung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF AND SYSTEM FOR MANUFACTURING SEMICO...
- Publication number 20240096865
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hsin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240071954
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE
- Publication number 20240071953
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063081
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038626
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Publication number 20230369173
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230317585
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD FOR DETECTING IMAGES
- Publication number 20230170368
- Publication date Jun 1, 2023
- VisEra Technologies Company Limited
- Wei-Lung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Staggered Metal Mesh on Backside of Device Die and Method Forming Same
- Publication number 20230154764
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY-BACKED SLOT ANTENNA SYSTEM
- Publication number 20230122470
- Publication date Apr 20, 2023
- ASUSTEK COMPUTER INC.
- Shih-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20230125020
- Publication date Apr 20, 2023
- iWave Technologies Co., Ltd.
- Chong-Yi LIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME
- Publication number 20230114558
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20230066456
- Publication date Mar 2, 2023
- Siliconware Precision Industries Co., Ltd.
- Pei-Geng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FORMING THE SAME
- Publication number 20230029820
- Publication date Feb 2, 2023
- VisEra Technologies Company Limited
- Wei-Lung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF AND SYSTEM FOR MANUFACTURING SEMICO...
- Publication number 20230035939
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hsin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE, PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20230035212
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRFLOW DETECTION DEVICE FOR DETECTING WHETHER AIR OUTPUT PATH IS O...
- Publication number 20220326054
- Publication date Oct 13, 2022
- Alpha Networks Inc.
- Wei-Hung TSAI
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC CURTAIN AND ELECTRONIC DEVICE
- Publication number 20220221762
- Publication date Jul 14, 2022
- TPK ADVANCED SOLUTIONS INC.
- Tsai Kuei Wei
- G06 - COMPUTING CALCULATING COUNTING

Wei-Feng Tsai

Person

Patents Grantslast 30 patents

Cavity-backed slot antenna system

Shield structure for backside through substrate vias (TSVs)

Package structure

Touchpad assembly

Semiconductor device, method of and system for manufacturing semico...

Integrated circuit, system and method of forming the same

Devices and methods for detecting cancerous cells

Semiconductor device, method of and system for manufacturing semico...

Memory device, package structure and fabricating method thereof

Medium passage switching mechanism disposed on a casing of an image...

Medium passage switching mechanism and related image forming device

Electronic package and circuit structure thereof

Method of forming shield structure for backside through substrate v...

Airflow detection device for detecting whether air output path is o...

Three-dimensional touch module and detection method thereof

Image forming device with a collapsible guiding mechanism

Touch display apparatus, driver integrated circuit and touch displa...

Integrated circuit, system and method of forming the same

Method for detecting cholangiocarcinoma cells

Three-dimensional sensing module and method of manufacturing the sa...

Electronic curtain and electronic device

Forming STI regions to separate semiconductor Fins

Package structure with separated street between chips

Non-common-ground bandpass filter circuit with electrostatic discha...

Analog-to-digital converter device equipped with conversion suspens...

Chemical mechanical polishing method

Touch sensing layer and touch panel

Integrated circuit

Pressure sensing module, touch panel and method of detecting two-po...

Method and system for positioning and tracking using a plurality of...

Patents Applicationslast 30 patents

WAFER CHUCK INCLUDING SELF-SEALING VACUUM SEAL ASSEMBLIES AND METHO...

SEMICONDUCTOR DEVICE

TOUCHPAD ASSEMBLY

METHODS FOR ISOLATION PROCESS CONTROL AND STRUCTURES THEREOF

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME

DISPLAY DEVICE

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF

IMAGE SENSOR AND METHOD FOR FORMING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

FLAT BENDABLE CASE HAVING A SUPPORT MECHANISM

TOUCHPAD ASSEMBLY

IMAGE SENSOR

SEMICONDUCTOR DEVICE, METHOD OF AND SYSTEM FOR MANUFACTURING SEMICO...

PACKAGE STRUCTURE

METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR AND METHOD FOR DETECTING IMAGES

Staggered Metal Mesh on Backside of Device Die and Method Forming Same

CAVITY-BACKED SLOT ANTENNA SYSTEM

ANTENNA DEVICE

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING THE SAME

SUBSTRATE STRUCTURE

IMAGE SENSOR AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE, METHOD OF AND SYSTEM FOR MANUFACTURING SEMICO...

MEMORY DEVICE, PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

AIRFLOW DETECTION DEVICE FOR DETECTING WHETHER AIR OUTPUT PATH IS O...

ELECTRONIC CURTAIN AND ELECTRONIC DEVICE