WEI GAO

Person

Tianjin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating 3-dimensional fan-out structure
- Patent number 10,283,477
- Issue date May 7, 2019
- NXP USA, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging integrated circuit die and device
- Patent number 10,083,912
- Issue date Sep 25, 2018
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for multi-die packaging
- Patent number 10,068,841
- Issue date Sep 4, 2018
- NXP USA, INC.
- Zhiwei Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for multi-die packaging
- Patent number 9,721,881
- Issue date Aug 1, 2017
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed pad integrated circuit package with mold lock
- Patent number 9,362,211
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for singulating electronic components from a substrate
- Patent number 9,142,434
- Issue date Sep 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for quad flat no lead packaging
- Patent number 9,034,697
- Issue date May 19, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of assembling same
- Patent number 8,735,223
- Issue date May 27, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process to create wettable lead flank during board assembly
- Patent number 8,329,509
- Issue date Dec 11, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...
- Publication number 20240112989
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARTUS AND METHODS FOR MULTI-DIE PACKAGING
- Publication number 20170317020
- Publication date Nov 2, 2017
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING 3-DIMENSIONAL FAN-OUT STRUCTURE
- Publication number 20170200701
- Publication date Jul 13, 2017
- NXP USA, Inc.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING INTEGRATED CIRCUIT DIE AND DEVICE
- Publication number 20170133349
- Publication date May 11, 2017
- FREESCALE SEMICONDUCTOR, INC.
- ZHIWEI GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF ASSEMBLING SAME
- Publication number 20130056861
- Publication date Mar 7, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MOLDING SEMICONDUCTOR DEVICE
- Publication number 20130005087
- Publication date Jan 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Quan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Process to Create Wettable Lead Flank During Board Assembly
- Publication number 20110244629
- Publication date Oct 6, 2011
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SINGULATING ELECTRONIC COMPONENTS FROM A SUBSTRATE
- Publication number 20110217814
- Publication date Sep 8, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR PACKAGE
- Publication number 20080283980
- Publication date Nov 20, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK
- Publication number 20080029860
- Publication date Feb 7, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Wei GAO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of fabricating 3-dimensional fan-out structure

Method of packaging integrated circuit die and device

Apparatus and methods for multi-die packaging

Apparatus and methods for multi-die packaging

Exposed pad integrated circuit package with mold lock

Method for singulating electronic components from a substrate

Apparatus and methods for quad flat no lead packaging

Semiconductor devices and methods of assembling same

Packaging process to create wettable lead flank during board assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...

APPARTUS AND METHODS FOR MULTI-DIE PACKAGING

METHOD OF FABRICATING 3-DIMENSIONAL FAN-OUT STRUCTURE

METHOD OF PACKAGING INTEGRATED CIRCUIT DIE AND DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF ASSEMBLING SAME

METHOD AND APPARATUS FOR MOLDING SEMICONDUCTOR DEVICE

Packaging Process to Create Wettable Lead Flank During Board Assembly

METHOD FOR SINGULATING ELECTRONIC COMPONENTS FROM A SUBSTRATE

LEAD FRAME FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK