Wei-Heng Shan

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding pads of printed circuit board capable of holding solder bal...
- Patent number 6,911,604
- Issue date Jun 28, 2005
- Ultratera Corporation
- Chung-Che Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mold structure for package fabrication
- Patent number 6,857,865
- Issue date Feb 22, 2005
- UltraTera Corporation
- Chung-Che Tsai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Double-sided thermally enhanced IC chip package
- Patent number 6,849,932
- Issue date Feb 1, 2005
- Ultratera Corporation
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package with enhanced thermal conductivity
- Patent number 6,713,856
- Issue date Mar 30, 2004
- Ultratera Corporation
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 6,709,894
- Issue date Mar 23, 2004
- UltraTera Corporation
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile stack semiconductor package
- Patent number 6,683,385
- Issue date Jan 27, 2004
- UltraTera Corporation
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile stack semiconductor package
- Patent number 6,555,919
- Issue date Apr 29, 2003
- UltraTera Corporation
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED CHIP PACKAGE WITH ENHANCED THERMAL CONDUCTIVITY
- Publication number 20040041249
- Publication date Mar 4, 2004
- United Test Center Inc.
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-sided thermally enhanced IC chip package
- Publication number 20040042140
- Publication date Mar 4, 2004
- United Test Center Inc.
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pads of printed circuit board capable of holding solder bal...
- Publication number 20040020688
- Publication date Feb 5, 2004
- United Test Center Inc.
- Chung-Che Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mold structure for package fabrication
- Publication number 20030235636
- Publication date Dec 25, 2003
- Ultra Tera Corporation
- Chung-Che Tsai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Strengthened bonding mechanism for semiconductor package
- Publication number 20030234276
- Publication date Dec 25, 2003
- UltraTera Corporation
- Chung-Che Tsai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire-bonded chip on board package
- Publication number 20030205793
- Publication date Nov 6, 2003
- Chong-Ren Maa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip package
- Publication number 20030201544
- Publication date Oct 30, 2003
- Chong-Ren Maa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE STACK SEMICONDUCTOR PACKAGE
- Publication number 20030197282
- Publication date Oct 23, 2003
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for fabricating the same
- Publication number 20030153123
- Publication date Aug 14, 2003
- UltraTera Corporation
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Wei-Heng Shan

Person

Patents Grantslast 30 patents

Bonding pads of printed circuit board capable of holding solder bal...

Mold structure for package fabrication

Double-sided thermally enhanced IC chip package

Stacked chip package with enhanced thermal conductivity

Semiconductor package and method for fabricating the same

Low profile stack semiconductor package

Low profile stack semiconductor package

Patents Applicationslast 30 patents

STACKED CHIP PACKAGE WITH ENHANCED THERMAL CONDUCTIVITY

Double-sided thermally enhanced IC chip package

Bonding pads of printed circuit board capable of holding solder bal...

Mold structure for package fabrication

Strengthened bonding mechanism for semiconductor package

Wire-bonded chip on board package

Flip chip package

LOW PROFILE STACK SEMICONDUCTOR PACKAGE

Semiconductor package and method for fabricating the same