Wei-hu Koh

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sectioned wearable smartphone devices
- Patent number 11,190,629
- Issue date Nov 30, 2021
- Wei Hu Koh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin mobile and wearable devices
- Patent number 11,005,983
- Issue date May 11, 2021
- Wei Hu Koh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Foldable wedge-shaped mobile electronic device
- Patent number 10,601,968
- Issue date Mar 24, 2020
- Wei Hu Koh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Portable image capture and camera device
- Patent number 8,553,090
- Issue date Oct 8, 2013
- Kingston Technology Corporation
- George Shiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of fabricating a chip
- Patent number 8,445,297
- Issue date May 21, 2013
- Kingston Technology Corporation
- Wei Koh
- G11 - INFORMATION STORAGE
Information Patent Grant
Folding USB drive
- Patent number 8,203,847
- Issue date Jun 19, 2012
- Kingston Technology Corporation
- Wei Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waterproof USB drives and method of making
- Patent number 8,071,895
- Issue date Dec 6, 2011
- Kingston Technology Corporation
- George Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated leadframe semiconductor package for random access memo...
- Patent number 7,781,873
- Issue date Aug 24, 2010
- Kingston Technology Corporation
- Wei H. Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe semiconductor package stand and method for making the same
- Patent number 7,781,299
- Issue date Aug 24, 2010
- Kingston Technology Corporation
- Wei H. Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-capacity memory card and method of making the same
- Patent number 7,663,214
- Issue date Feb 16, 2010
- Kingston Technology Corporation
- Wei Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof USB drives and method of making
- Patent number 7,652,892
- Issue date Jan 26, 2010
- Kingston Technology Corporation
- George Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Folding USB drive
- Patent number 7,623,354
- Issue date Nov 24, 2009
- Kingston Technology Corporation
- Wei Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a chip
- Patent number 7,608,469
- Issue date Oct 27, 2009
- Kingston Technology Corporation
- Wei Koh
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory module and card with integrated RFID tag
- Patent number 7,564,359
- Issue date Jul 21, 2009
- Kingston Technology Corporation
- Wei H. Koh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flash memory card
- Patent number 7,411,292
- Issue date Aug 12, 2008
- Kingston Technology Corporation
- Ben Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for molding a small form factor digital memory card
- Patent number 7,378,301
- Issue date May 27, 2008
- Kingston Technology Corporation
- Wei H. Koh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High density memory card assembly
- Patent number 7,317,250
- Issue date Jan 8, 2008
- Kingston Technology Corporation
- Wei H. Koh
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-level package for a memory module
- Patent number 6,737,738
- Issue date May 18, 2004
- Kingston Technology Corporation
- Wei H. Koh
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated multi-chip chip scale package
- Patent number 6,686,656
- Issue date Feb 3, 2004
- Kingston Technology Corporation
- Wei H. Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature resistant thin-film system
- Patent number 6,291,889
- Issue date Sep 18, 2001
- Northrop Grumman Corporation
- Wei Koh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process of vacuum annealing a thin film metallization on high purit...
- Patent number 5,856,235
- Issue date Jan 5, 1999
- Northrop Grumman Corporation
- Wei NMI Koh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-core two-side substrate with u-strip and co-planar signal tr...
- Patent number 5,825,084
- Issue date Oct 20, 1998
- Express Packaging Systems, Inc.
- John H. Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microcircuit via interconnect
- Patent number 5,717,247
- Issue date Feb 10, 1998
- Grumman Aerospace Corporation
- Wei H. Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a microcircuit via interconnect
- Patent number 5,599,744
- Issue date Feb 4, 1997
- Grumman Aerospace Corporation
- Wei H. Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin substrate micro-via interconnect
- Patent number 5,493,096
- Issue date Feb 20, 1996
- Grumman Aerospace Corporation
- Wei H. Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared detector substrate with breakaway test tabs
- Patent number 5,475,224
- Issue date Dec 12, 1995
- Grumman Aerospace Corporation
- Wei H. Koh
- G01 - MEASURING TESTING
Information Patent Grant
Surround view detector focal plane
- Patent number 5,464,979
- Issue date Nov 7, 1995
- Grumman Aerospace Corporation
- Wei H. Koh
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming multilayer indium bump contacts
- Patent number 5,393,696
- Issue date Feb 28, 1995
- Grumman Aerosace Corp.
- Wei Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a precisely spaced stack of substrate layers
- Patent number 5,209,798
- Issue date May 11, 1993
- Grunman Aerospace Corporation
- Allen L. Solomon
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for forming multilayer indium bump contact
- Patent number 5,149,671
- Issue date Sep 22, 1992
- Grumman Aerospace Corporation
- Wei Koh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fan-out Wafer Level Package having Small Interposers
- Publication number 20240014140
- Publication date Jan 11, 2024
- Wei Hu Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manual Oar Propulsion Systems for Standup Paddle Boards
- Publication number 20230211862
- Publication date Jul 6, 2023
- Wei Hu Koh
- B63 - SHIPS OR OTHER WATERBORNE VESSELS RELATED EQUIPMENT
Information Patent Application
Handheld Folding Electronic Device
- Publication number 20200348729
- Publication date Nov 5, 2020
- Wei Hu Koh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SECURED REMOVABLE STORAGE DEVICE
- Publication number 20110246790
- Publication date Oct 6, 2011
- GAINTEAM HOLDINGS LIMITED
- Wei-hu Koh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH-DENSITY MEMORY ASSEMBLY
- Publication number 20110051385
- Publication date Mar 3, 2011
- GAINTEAM HOLDINGS LIMITED
- Wei-hu Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT MODULE
- Publication number 20110019370
- Publication date Jan 27, 2011
- GAINTEAM HOLDINGS LIMITED
- Wei-hu Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATERPROOF USB DRIVES AND METHOD OF MAKING
- Publication number 20100124010
- Publication date May 20, 2010
- Kingston Technology Corporation
- George SHIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOLDING USB DRIVE
- Publication number 20100061070
- Publication date Mar 11, 2010
- Kingston Technology Corporation
- Wei Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING A CHIP
- Publication number 20100015736
- Publication date Jan 21, 2010
- Kingston Technology Corporation
- Wei Koh
- G11 - INFORMATION STORAGE
Information Patent Application
Portable image capture and camera device
- Publication number 20080062263
- Publication date Mar 13, 2008
- George Shiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Memory module and card with integrated RFID tag
- Publication number 20070257802
- Publication date Nov 8, 2007
- Wei H. Koh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Waterproof USB drives and method of making
- Publication number 20070206365
- Publication date Sep 6, 2007
- Kingston Technology Company, Inc.
- George Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Folding USB drive
- Publication number 20070070611
- Publication date Mar 29, 2007
- Kingston Technology Company, Inc.
- Wei Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flash memory card
- Publication number 20070069390
- Publication date Mar 29, 2007
- Ben Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a chip
- Publication number 20070049092
- Publication date Mar 1, 2007
- Wei Koh
- G11 - INFORMATION STORAGE
Information Patent Application
High-capacity memory card and method of making the same
- Publication number 20070018297
- Publication date Jan 25, 2007
- Kingston Technology Company, Inc.
- Wei Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for molding a small form factor digital memory card
- Publication number 20060281229
- Publication date Dec 14, 2006
- Wei H. Koh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Leadframe semiconductor package stand and method for making the same
- Publication number 20060228832
- Publication date Oct 12, 2006
- Wei H. Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density memory card assembly
- Publication number 20060072368
- Publication date Apr 6, 2006
- Wei H. Koh
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor package for random access memory integrated circuits
- Publication number 20040212053
- Publication date Oct 28, 2004
- Wei H. Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-level package for a memory module
- Publication number 20040012992
- Publication date Jan 22, 2004
- Wei H. Koh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Person

Patents Grantslast 30 patents

Sectioned wearable smartphone devices

Thin mobile and wearable devices

Foldable wedge-shaped mobile electronic device

Portable image capture and camera device

Method of fabricating a chip

Folding USB drive

Waterproof USB drives and method of making

Encapsulated leadframe semiconductor package for random access memo...

Leadframe semiconductor package stand and method for making the same

High-capacity memory card and method of making the same

Waterproof USB drives and method of making

Folding USB drive

Method of fabricating a chip

Memory module and card with integrated RFID tag

Flash memory card

Method for molding a small form factor digital memory card

High density memory card assembly

Multi-level package for a memory module

Integrated multi-chip chip scale package

High temperature resistant thin-film system

Process of vacuum annealing a thin film metallization on high purit...

Single-core two-side substrate with u-strip and co-planar signal tr...

Microcircuit via interconnect

Method of forming a microcircuit via interconnect

Thin substrate micro-via interconnect

Infrared detector substrate with breakaway test tabs

Surround view detector focal plane

Method for forming multilayer indium bump contacts

Method of forming a precisely spaced stack of substrate layers

Method for forming multilayer indium bump contact

Patents Applicationslast 30 patents

Fan-out Wafer Level Package having Small Interposers

Manual Oar Propulsion Systems for Standup Paddle Boards

Handheld Folding Electronic Device

SECURED REMOVABLE STORAGE DEVICE

HIGH-DENSITY MEMORY ASSEMBLY

FLEXIBLE CIRCUIT MODULE

WATERPROOF USB DRIVES AND METHOD OF MAKING

FOLDING USB DRIVE

METHOD OF FABRICATING A CHIP

Portable image capture and camera device

Memory module and card with integrated RFID tag

Waterproof USB drives and method of making

Folding USB drive

Flash memory card

Method of fabricating a chip

High-capacity memory card and method of making the same

Method for molding a small form factor digital memory card

Leadframe semiconductor package stand and method for making the same

High density memory card assembly

Semiconductor package for random access memory integrated circuits

Multi-level package for a memory module