Membership
Tour
Register
Log in
Wei Keat LOH
Follow
Person
Bayan Lepas, MY
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Stress-relief layers and stress-compensation collars with low-tempe...
Patent number
7,291,548
Issue date
Nov 6, 2007
Intel Corporation
Daewoong Suh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stress-relief layers and stress-compensation collars with low-tempe...
Patent number
7,253,088
Issue date
Aug 7, 2007
Intel Corporation
Daewoong Suh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate grooves to reduce underfill fillet bridging
Patent number
7,179,683
Issue date
Feb 20, 2007
Intel Corporation
Al Ling Low
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LOWER IC PACKAGE STRUCTURE FOR COUPLING WITH AN UPPER IC PACKAGE TO...
Publication number
20180374833
Publication date
Dec 27, 2018
Intel Corporation
Shaw Fong Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Lower IC Package Structure for Coupling with an Upper IC Package to...
Publication number
20120159118
Publication date
Jun 21, 2012
Shaw Fong Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTOR REINFORCEMENT FOR CIRCUIT BOARDS
Publication number
20090016036
Publication date
Jan 15, 2009
Shaw Fong WONG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STRESS-RELIEF LAYERS AND STRESS-COMPENSATION COLLARS WITH LOW-TEMPE...
Publication number
20070190772
Publication date
Aug 16, 2007
Intel Corporation
Daewoong Suh
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Stress-relief layers and stress-compensation collars with low-tempe...
Publication number
20060068579
Publication date
Mar 30, 2006
Daewoong Suh
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...