Wei Kee CHAN

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Kuala Lumpur, MY

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame with grooved lead finger
- Patent number 9,006,874
- Issue date Apr 14, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with grooved lead finger
- Patent number 8,643,159
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package including die paddle with steps
- Patent number 7,982,293
- Issue date Jul 19, 2011
- Infineon Technologies AG
- Wei Kee Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME WITH GROOVED LEAD FINGER
- Publication number 20140120664
- Publication date May 1, 2014
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH GROOVED LEAD FINGER
- Publication number 20130264693
- Publication date Oct 10, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package
- Publication number 20090250797
- Publication date Oct 8, 2009
- INFINEON TECHNOLOGIES AG
- Wei Kee Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20090230519
- Publication date Sep 17, 2009
- INFINEON TECHNOLOGIES AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS