Wei Kuo SHIH

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional phase change memory device including vertically c...
- Patent number 11,043,537
- Issue date Jun 22, 2021
- Western Digital Technologies, Inc.
- Yuji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level loop cut process for a three-dimensional memory device...
- Patent number 11,011,581
- Issue date May 18, 2021
- Western Digital Technologies, Inc.
- Yuji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional cross-point memory device containing inter-level...
- Patent number 10,991,761
- Issue date Apr 27, 2021
- SanDisk Technologies LLC
- Yuji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including laterally constricted cur...
- Patent number 10,964,752
- Issue date Mar 30, 2021
- Western Digital Technologies, Inc.
- Yuji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional cross-point memory device containing inter-level...
- Patent number 10,879,313
- Issue date Dec 29, 2020
- SanDisk Technologies LLC
- Yuji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing cobalt capped copper lin...
- Patent number 10,748,966
- Issue date Aug 18, 2020
- SanDisk Technologies LLC
- Satoru Mayuzumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY CONSTRICTED CUR...
- Publication number 20200395408
- Publication date Dec 17, 2020
- Western Digital Technologies, Inc.
- Yuji TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PHASE CHANGE MEMORY DEVICE INCLUDING VERTICALLY C...
- Publication number 20200395407
- Publication date Dec 17, 2020
- Western Digital Technologies, Inc.
- Yuji TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL LOOP CUT PROCESS FOR A THREE-DIMENSIONAL MEMORY DEVICE...
- Publication number 20200388649
- Publication date Dec 10, 2020
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Yuji TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CROSS-POINT MEMORY DEVICE CONTAINING INTER-LEVEL...
- Publication number 20200365658
- Publication date Nov 19, 2020
- SANDISK TECHNOLOGIES LLC
- Yuji TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CROSS-POINT MEMORY DEVICE CONTAINING INTER-LEVEL...
- Publication number 20200365654
- Publication date Nov 19, 2020
- SANDISK TECHNOLOGIES LLC
- Yuji TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COBALT CAPPED COPPER LIN...
- Publication number 20200006431
- Publication date Jan 2, 2020
- SANDISK TECHNOLOGIES LLC
- Satoru MAYUZUMI
- H01 - BASIC ELECTRIC ELEMENTS

Wei Kuo SHIH

Person

Patents Grantslast 30 patents

Three-dimensional phase change memory device including vertically c...

Multi-level loop cut process for a three-dimensional memory device...

Three-dimensional cross-point memory device containing inter-level...

Three-dimensional memory device including laterally constricted cur...

Three-dimensional cross-point memory device containing inter-level...

Three-dimensional memory device containing cobalt capped copper lin...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY CONSTRICTED CUR...

THREE-DIMENSIONAL PHASE CHANGE MEMORY DEVICE INCLUDING VERTICALLY C...

MULTI-LEVEL LOOP CUT PROCESS FOR A THREE-DIMENSIONAL MEMORY DEVICE...

THREE-DIMENSIONAL CROSS-POINT MEMORY DEVICE CONTAINING INTER-LEVEL...

THREE-DIMENSIONAL CROSS-POINT MEMORY DEVICE CONTAINING INTER-LEVEL...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COBALT CAPPED COPPER LIN...