Wei-Le Shen

Person

  • Santa Clara, CA, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SCALING FOR DIE-LAST ADVANCED IC PACKAGING

    • Publication number 20240126180
    • Publication date Apr 18, 2024
    • Applied Materials, Inc.
    • Jang Fung CHEN
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    MPEG video editing-cut and paste

    • Publication number 20020126754
    • Publication date Sep 12, 2002
    • Wei-Le Shen
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE