Wei Lee Lim

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Permatang Pauh, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
- Patent number 11,817,418
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Comprising a Can Housing a Semiconductor Die w...
- Publication number 20210159204
- Publication date May 27, 2021
- INFINEON TECHNOLOGIES AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion Enhancing Structures for a Package
- Publication number 20200043876
- Publication date Feb 6, 2020
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS