Wei Meng

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for forming semiconductor package h...
- Patent number 9,875,973
- Issue date Jan 23, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming semiconductor package h...
- Patent number 9,520,365
- Issue date Dec 13, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 9,472,562
- Issue date Oct 18, 2016
- United Microelectronics Corp.
- Qiu-Ji Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming semiconductor package h...
- Patent number 8,492,203
- Issue date Jul 23, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY CELLS WITH THREE-DIMENSIONAL GATE COUPLING AND METHODS OF FO...
- Publication number 20230345718
- Publication date Oct 26, 2023
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wei MENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20160322372
- Publication date Nov 3, 2016
- United Microelectronics Corp.
- Qiu-Ji Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Semiconductor Package H...
- Publication number 20130241048
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Semiconductor Package H...
- Publication number 20130140719
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Semiconductor Package H...
- Publication number 20120187584
- Publication date Jul 26, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS