Membership
Tour
Register
Log in
Wei Qiang Jin
Follow
Person
Shanghai, CN
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit packaging system with interposer and method of m...
Patent number
9,184,122
Issue date
Nov 10, 2015
Stats Chippac Ltd.
Wei Qiang Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-stage sliding structure of handheld device
Patent number
8,362,667
Issue date
Jan 29, 2013
Inventec Appliances Corp.
Wei Jin
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Integrated circuit package system for chip on lead
Patent number
7,701,042
Issue date
Apr 20, 2010
Stats Chippac Ltd.
Shao Jian Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF M...
Publication number
20130328216
Publication date
Dec 12, 2013
Wei Qiang Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND ME...
Publication number
20110248391
Publication date
Oct 13, 2011
Wei Qiang Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-STAGE SLIDING STRUCTURE OF HANDHELD DEVICE
Publication number
20100067833
Publication date
Mar 18, 2010
Wei JIN
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR CHIP ON LEAD
Publication number
20080073781
Publication date
Mar 27, 2008
Shao Jian Chen
H01 - BASIC ELECTRIC ELEMENTS