TREA

Wei Qun Peng

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  • Coppell, TX, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Stable gold bump solder connections
    • Patent number 7,939,939
    • Issue date May 10, 2011
    • Texas Instruments Incorporated
    • Kejun Zeng
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    CORROSION-RESISTANT COPPER-TO-ALUMINUM BONDS
    • Publication number 20120001336
    • Publication date Jan 5, 2012
    • TEXAS INSTRUMENTS INCORPORATED
    • Kejun ZENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stable Gold Bump Solder Connections
    • Publication number 20110177686
    • Publication date Jul 21, 2011
    • TEXAS INSTRUMENTS INCORPORATED
    • Kejun Zeng
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STABLE GOLD BUMP SOLDER CONNECTIONS
    • Publication number 20110108980
    • Publication date May 12, 2011
    • TEXAS INSTRUMENTS INCORPORATED
    • Kejun Zeng
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stable Gold Bump Solder Connections
    • Publication number 20090091024
    • Publication date Apr 9, 2009
    • TEXAS INSTRUMENTS INCORPORATED
    • Kejun Zeng
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Gold-Tin Solder Joints Having Reduced Embrittlement
    • Publication number 20080083993
    • Publication date Apr 10, 2008
    • TEXAS INSTRUMENTS INCORPORATED
    • Kejun Zeng
    • H01 - BASIC ELECTRIC ELEMENTS