Wei-Shan Wang

Follow

Person

Neubiberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with expanded heat spreader
- Patent number 11,600,547
- Issue date Mar 7, 2023
- Infineon Technologies Austria AG
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Fabricating a Semiconductor Device by Using Different Co...
- Publication number 20210175157
- Publication date Jun 10, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Expanded Heat Spreader
- Publication number 20210166988
- Publication date Jun 3, 2021
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS