Wei Tan

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Controlled solder height packages and assembly processes
- Patent number 9,960,105
- Issue date May 1, 2018
- Intel Corporation
- Hongin Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid low metal loading flux
- Patent number 9,950,393
- Issue date Apr 24, 2018
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux materials for heated solder placement and associated technique...
- Patent number 9,283,641
- Issue date Mar 15, 2016
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques and configurations for surface treatment of an integrate...
- Patent number 8,895,365
- Issue date Nov 25, 2014
- Intel Corporation
- Suriyakala Ramalingam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20210288021
- Publication date Sep 16, 2021
- Intel Corporation
- Mihir Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-FLOW ADHESIVE FOR SECOND AND THIRD LEVEL INTERCONNECTS
- Publication number 20180324955
- Publication date Nov 8, 2018
- Intel Corporation
- Mohit SOOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY (BGA) APPARATUS AND METHODS
- Publication number 20170066088
- Publication date Mar 9, 2017
- Intel Corporation
- Mohit Sood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PICKHEAD FOR SOLDER BALL PLACEMENT ON AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20160181222
- Publication date Jun 23, 2016
- Mohit Sood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLED SOLDER HEIGHT PACKAGES AND ASSEMBLY PROCESSES
- Publication number 20140091457
- Publication date Apr 3, 2014
- Hongjin JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX MATERIALS FOR HEATED SOLDER PLACEMENT AND ASSOCIATED TECHNIQUE...
- Publication number 20140084461
- Publication date Mar 27, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...
- Publication number 20140061902
- Publication date Mar 6, 2014
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20130341379
- Publication date Dec 26, 2013
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Controlled solder height packages and assembly processes

Hybrid low metal loading flux

Flux materials for heated solder placement and associated technique...

Techniques and configurations for surface treatment of an integrate...

Patents Applicationslast 30 patents

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

NO-FLOW ADHESIVE FOR SECOND AND THIRD LEVEL INTERCONNECTS

HYBRID LOW METAL LOADING FLUX

BALL GRID ARRAY (BGA) APPARATUS AND METHODS

PICKHEAD FOR SOLDER BALL PLACEMENT ON AN INTEGRATED CIRCUIT PACKAGE

CONTROLLED SOLDER HEIGHT PACKAGES AND ASSEMBLY PROCESSES

FLUX MATERIALS FOR HEATED SOLDER PLACEMENT AND ASSOCIATED TECHNIQUE...

TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...

HYBRID LOW METAL LOADING FLUX