Wei Wang

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Guilderland, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Reconfigurable RF/digital hybrid 3D interconnect
- Patent number 8,916,910
- Issue date Dec 23, 2014
- Research Foundation of State University of New York
- Robert E. Geer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional architecture for integration of CMOS circuits and...
- Patent number 8,154,319
- Issue date Apr 10, 2012
- The Research Foundation of State University of New York
- Wei Wang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Passivated copper conductive layers for microelectronic applications
- Patent number 6,057,223
- Issue date May 2, 2000
- The Research Foundation of State University of New York
- William A. Lanford
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Passivated copper conductive layers for microelectronic application...
- Patent number 5,766,379
- Issue date Jun 16, 1998
- The Research Foundation of State University of New York
- William A. Lanford
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
RECONFIGURABLE RF/DIGITAL HYBRID 3D INTERCONNECT
- Publication number 20120146099
- Publication date Jun 14, 2012
- Research Foundation of State University of New York
- Robert E. Geer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL ARCHITECTURE FOR INTEGRATION OF CMOS CIRCUITS AND...
- Publication number 20100133587
- Publication date Jun 3, 2010
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- Wei Wang
- G11 - INFORMATION STORAGE