Wei Wang

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal compression flip chip bump for high performance and fine pitch
- Patent number 12,113,038
- Issue date Oct 8, 2024
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unified front-end receiver interface for accommodating incoming sig...
- Patent number 9,584,184
- Issue date Feb 28, 2017
- QUALCOMM Incorporated
- Miao Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...
- Publication number 20240387429
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (...
- Publication number 20240243056
- Publication date Jul 18, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS HAVING A PRO...
- Publication number 20240079307
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS
- Publication number 20240006361
- Publication date Jan 4, 2024
- QUALCOMM Incorporated
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES
- Publication number 20230369261
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION FLIP CHIP BUMP
- Publication number 20210210449
- Publication date Jul 8, 2021
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCO...
- Publication number 20180331061
- Publication date Nov 15, 2018
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED FRONT-END RECEIVER INTERFACE FOR ACCOMMODATING INCOMING SIG...
- Publication number 20140256276
- Publication date Sep 11, 2014
- QUALCOMM Incorporated
- Miao Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Person

Patents Grantslast 30 patents

Thermal compression flip chip bump for high performance and fine pitch

Unified front-end receiver interface for accommodating incoming sig...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (...

PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS HAVING A PRO...

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

THERMAL COMPRESSION FLIP CHIP BUMP

INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCO...

UNIFIED FRONT-END RECEIVER INTERFACE FOR ACCOMMODATING INCOMING SIG...