Wei Wei

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Omni directional interconnect with magnetic fillers in mold matrix
- Patent number 12,354,883
- Issue date Jul 8, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...
- Publication number 20250105074
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
- Publication number 20240222259
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL LAYER WITH ROUGHENED SURFACES
- Publication number 20240222136
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006300
- Publication date Jan 4, 2024
- Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006285
- Publication date Jan 4, 2024
- The Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX
- Publication number 20230101629
- Publication date Mar 30, 2023
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Omni directional interconnect with magnetic fillers in mold matrix

Patents Applicationslast 30 patents

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...

ELECTRICAL LAYER WITH ROUGHENED SURFACES

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX