Wei-Wen Lan

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Taoyuan County, TW

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Patents Grantslast 30 patents

Information Patent Grant
High density package substrate and method for fabricating the same
- Patent number 8,058,567
- Issue date Nov 15, 2011
- NAN YA PCB Corp.
- Meng-Han Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a wire bonding substrate
- Patent number 7,877,873
- Issue date Feb 1, 2011
- NAN YA PCB Corp.
- Meng-Han Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20090283315
- Publication date Nov 19, 2009
- NAN YA PCB CORP.
- Meng-Han Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING SUBSTRATE AND FABRICATION THEREOF
- Publication number 20090206487
- Publication date Aug 20, 2009
- NAN YA PCB CORP.
- Meng-Han Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR