Wei Yeeng Ng

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for mitigating crack propagation in semiconduct...
- Patent number 12,347,732
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Wei Yeeng Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including oxide material between decks ther...
- Patent number 12,310,024
- Issue date May 20, 2025
- Lodestar Licensing Group LLC
- Andrew Bicksler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,256,546
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 12,063,783
- Issue date Aug 13, 2024
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including an oxide material between adjacen...
- Patent number 11,917,825
- Issue date Feb 27, 2024
- Andrew Bicksler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,844,220
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having rugged material fill, and methods of f...
- Patent number 11,805,645
- Issue date Oct 31, 2023
- Micron Technology, Inc.
- Nicholas R. Tapias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,700,729
- Issue date Jul 11, 2023
- Micron Technology, Inc.
- Yi Hu
Information Patent Grant
Systems and methods for mitigating crack propagation in semiconduct...
- Patent number 11,637,040
- Issue date Apr 25, 2023
- Micron Technology, Inc.
- Wei Yeeng Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,626,423
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,621,273
- Issue date Apr 4, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including an oxide material between adjacen...
- Patent number 11,355,514
- Issue date Jun 7, 2022
- Micron Technology, Inc.
- Andrew Bicksler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,205,654
- Issue date Dec 21, 2021
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,075,219
- Issue date Jul 27, 2021
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state memory device, and manufacturing method thereof
- Patent number 10,707,121
- Issue date Jul 7, 2020
- Intel Corporatino
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an array of elevationally-extending strings of m...
- Patent number 10,580,782
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Wei Yeeng Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improved etch stop layer or hard mask laye...
- Patent number 10,304,749
- Issue date May 28, 2019
- Intel Corporation
- Christopher W. Petz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250107094
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING OXIDE MATERIAL BETWEEN DECKS THER...
- Publication number 20240188297
- Publication date Jun 6, 2024
- Lodestar Licensing Group LLC
- Andrew Bicksler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240064982
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MITIGATING CRACK PROPAGATION IN SEMICONDUCT...
- Publication number 20230260840
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Yeeng Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20230209827
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230104297
- Publication date Apr 6, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING AN OXIDE MATERIAL BETWEEN ADJACEN...
- Publication number 20220262821
- Publication date Aug 18, 2022
- Micron Technology, Inc.
- Andrew Bicksler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MITIGATING CRACK PROPAGATION IN SEMICONDUCT...
- Publication number 20220208609
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Wei Yeeng Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20220077169
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210399012
- Publication date Dec 23, 2021
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210358940
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210057433
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210057428
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Rugged Material Fill, and Methods of F...
- Publication number 20210050364
- Publication date Feb 18, 2021
- Micro Technology, Inc.
- Nicholas R. Tapias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING AN OXIDE MATERIAL BETWEEN ADJACEN...
- Publication number 20210050362
- Publication date Feb 18, 2021
- Micron Technology, Inc.
- Andrew Bicksler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming An Array Of Elevationally-Extending Strings Of M...
- Publication number 20190206884
- Publication date Jul 4, 2019
- Micron Technology, Inc.
- Wei Yeeng Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED ETCH STOP LAYER OR HARD MASK LAYE...
- Publication number 20180366386
- Publication date Dec 20, 2018
- Intel Corporation
- Christopher W. Petz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Solid State Memory Device, and Manufacturing Method Thereof
- Publication number 20180190540
- Publication date Jul 5, 2018
- Intel Corporation
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS

Wei Yeeng Ng

Person

Patents Grantslast 30 patents

Systems and methods for mitigating crack propagation in semiconduct...

Microelectronic devices including oxide material between decks ther...

Integrated assemblies and methods of forming integrated assemblies

Memory arrays and methods used in forming a memory array comprising...

Microelectronic devices including an oxide material between adjacen...

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies having rugged material fill, and methods of f...

Memory arrays and methods used in forming a memory array comprising...

Systems and methods for mitigating crack propagation in semiconduct...

Memory arrays and methods used in forming a memory array comprising...

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices including an oxide material between adjacen...

Memory arrays and methods used in forming a memory array comprising...

Memory arrays and methods used in forming a memory array comprising...

Solid state memory device, and manufacturing method thereof

Methods of forming an array of elevationally-extending strings of m...

Method and apparatus for improved etch stop layer or hard mask laye...

Patents Applicationslast 30 patents

Integrated Assemblies and Methods of Forming Integrated Assemblies

MICROELECTRONIC DEVICES INCLUDING OXIDE MATERIAL BETWEEN DECKS THER...

Integrated Assemblies and Methods of Forming Integrated Assemblies

SYSTEMS AND METHODS FOR MITIGATING CRACK PROPAGATION IN SEMICONDUCT...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Integrated Assemblies and Methods of Forming Integrated Assemblies

MICROELECTRONIC DEVICES INCLUDING AN OXIDE MATERIAL BETWEEN ADJACEN...

SYSTEMS AND METHODS FOR MITIGATING CRACK PROPAGATION IN SEMICONDUCT...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Integrated Assemblies Having Rugged Material Fill, and Methods of F...

MICROELECTRONIC DEVICES INCLUDING AN OXIDE MATERIAL BETWEEN ADJACEN...

Methods Of Forming An Array Of Elevationally-Extending Strings Of M...

METHOD AND APPARATUS FOR IMPROVED ETCH STOP LAYER OR HARD MASK LAYE...

A Solid State Memory Device, and Manufacturing Method Thereof